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Suggested Items

The Clean Truth: The Clean Truth About No-Clean Flux

10/14/2026 | Dr. Adam Klett -- Column: The Clean Truth
One of the most misunderstood terms in electronics manufacturing is “no-clean flux.” It sounds simple enough: Use the flux, complete the soldering process, and, best of all, you don’t have to clean. Unfortunately, that interpretation has led to decades of confusion and, in some cases, preventable reliability problems.

Bridging the Pacific: Why Global Manufacturing Is No Longer Optional

09/23/2026 | Tianming Liu -- Column: Bridging the Pacific
Today, no serious electronics manufacturer operates in isolation. Even a company producing entirely within its own country depends on materials, equipment, software, components, technical standards, and knowledge likely developed elsewhere. Global manufacturing is not a possibility in the future, but is already present in the machines we operate, the products we build, and the markets we serve.

Secure PCB Sourcing Is Not Enough

09/15/2026 | Ryan O'Connor, SOMACIS
Defense teams are paying much closer attention to where their PCB work goes. That’s a smart approach. Approved suppliers, secure data, domestic production, and proper certifications all matter. But these factors do not address the tougher question: Does this specific board actually fit the supplier’s process? This is where sourcing decisions often become too general. A supplier might be approved and certified, but that does not mean every complex defense board is right for their shop.

The Relevance of VeCS as an HDI Process Option

08/20/2026 | Marcy LaRont, I-Connect007
Almost 10 years ago, Pete Starkey interviewed Joan Tourné, inventor and CEO of his new company, NextGin Technology. Joan’s resume included many years as a director at Mommers Print Service in the Netherlands, and then as advanced technology and business director with Viasystems Group. He had just secured his IP for a vertical conductive structure (VeCS), a novel means of creating high density vertical interconnections for semiconductors and complex, high layer count PCBs. This month, we re-examine VeCS technology, a method for HDI PCB fabrication with large backplane-type boards developed in partnership with Wus, which uses the technology in its factories.

Flex Connections: Four Lessons in Engineering Judgment for PCB Designers

08/20/2026 | Dan Skweres -- Column: Flex Connections
In my more than four decades in the industry, I’ve watched design tools and manufacturing capabilities evolve in ways we could hardly have imagined when I started, touching everything from conventional rigid boards to today’s highly sophisticated flexible and rigid-flex circuits. But anyone with meaningful experience in the PCB industry can relate to the phrase, “Just because you can doesn’t mean you should.”
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