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Matrix Introduces Specialty Process Equipment for the UHDI and IC Substrate Market
July 30, 2024 | Matrix ElectronicsEstimated reading time: 1 minute
Global expansion for semiconductor chips and the resulting requirement for UHDI and IC Substrate packaging has led to increased investments in PCB manufacturing capacity to support this growth. UHDI and IC packaging manufacturing requires new equipment dedicated to the specification and quality requirements for these product lines.
Matrix is proud to announce that our Hakuto and Advanced Engineering product lines available for UHDI and IC Substrate manufacturing is now available in the North American market.
From Hakuto:
- Mach 630/6630NP - The industry standard in dry film cut sheet laminators also supports the tacking processes for specialty packaging dielectric films such as ABF.
- Hakuto Mach 510PK has been designed for specialty packaging dry films and features enhanced clean room performance, improved lamination temperature and pressure capability and non-contact magnetic drive conveyors.
- Tonets V-Spec - specialty contactless panel cleaners, heaters and cooling solutions.
- Macoho Wet Blasting Equipment – Unique precision environmentally safe selective surface cleaning and material thinning process equipment.
From Advanced Engineering – in addition to the full product line of automated PCB process equipment supporting HDI and UHDI processes, Advanced Engineering has released the following new equipment to support IC Substrate manufacturing.
- PMB – 201 KCPB – building on the success of the PMA101-CPB mylar peeler, the PMB201 – KCPB offers enhanced peeling capability for specialty dry films and ABF films.
- CSD (Compact Storage Device) Buffer – this is a fast 30 panel buffer unit that provides simultaneous load and unload for panel hold time, overflow, and error buffer functions in a modern clean room compatible function.
- EDTA 652 – the latest generation of panel loading and unloading for the latest generation of AOI and direct imaging equipment.
- Full FOUP carriers and handling options for ultra-sensitive IC substrate and semiconductor packaging processing.
“We are pleased to represent this equipment to support the growing UHDI and IC substrate manufacturing capability in North America. These product solutions have an established leadership installed base that helps support rapid and reliable new facility and process start-ups,” said Bob Berg, Vice President of Business Development for Matrix.
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