Real Time with… THECA 2024: MacDermid Alpha Electronics Solutions–A Critical Comparison of Metallization Methods

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Market-Comms, VNU Asia Pacific Unite to Drive THECA 2025 as a PCB Industry Game-Changer

12/23/2024 | EINPresswire.com
Thailand Electronics Circuit Asia (THECA) 2025 has officially announced its event partnership with Market-Comms Co., Ltd. (MCOMMS), No.1 local public relations firm, and VNU Asia Pacific, the designated show manager for the event.

Real Time with… THECA 2024: Innovation and Economy in Factory Design Is Just Smart

08/14/2024 | Real Time with... THECA
Smart Factory Design's CEO, Alex Stepinski, provides an update on his work with zero liquid discharge solutions and lower-investment PCB fabrication setups. Both of these solutions, Stepinski argues, now cost less to operate than traditional methods, while providing more capability and sustainability.

Real Time with… THECA 2024: ENIG Paper Presented by MacDermid Alpha Electronics Solutions

08/13/2024 | Real Time with... THECA
Dr. Frank Xu reports on the paper he presented at THECA on ENIG processes, confirming that MacDermid Alpha Electronics Solution’s Affinity family of processes not only comply with IPC ENIG corrosion standards but also exceed them

Real Time with… THECA 2024: The Software Perspective at THECA 2024

08/07/2024 | Real Time with... THECA
Because Polar Instruments is a software provider, and has been present in the Thai market for 17 years, Mohd Fadzil, sales and service manager for Asia Pacific, has a distinctly different perspective on the recent growth in Thailand. Fadzil shares his market insight, as well as Polar’s growing and evolving support programs.

Real Time with… THECA 2024: State of the Art Copper Adhesion

08/09/2024 | Real Time with... THECA
Bruce Lee, MacDermid Alpha Electronics Solutions, joined Nolan Johnson following his paper presentation on the show's mainstage. Lee provided a detailed overview of the current state of adhesion promoters and discussed the interaction between mechanical adhesion, chemical adhesion, signal integrity, and substrate impacts.