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Real Time with… THECA 2024: State of the Art Copper Adhesion
August 9, 2024 | Real Time with... THECAEstimated reading time: Less than a minute
Bruce Lee, MacDermid Alpha Electronics Solutions, joined Nolan Johnson following his paper presentation on the show's mainstage. Lee provided a detailed overview of the current state of adhesion promoters and discussed the interaction between mechanical adhesion, chemical adhesion, signal integrity, and substrate impacts. Watch the interview now.
For our full coverage of THECA 2024, visit the Real Time with... THECA 2024 site.
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