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IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

09/16/2024 | IPC
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”

ASC Sunstone Circuits to Exhibit at the Anaheim Electronics & Manufacturing Show (AEMS) 2024

09/16/2024 | ASC Sunstone
American Standard Circuits | ASC Sunstone will be exhibiting at the Anaheim Electronics & Manufacturing Show 2024 to be held October 2-3 at the Anaheim Conventions Center in Anaheim, California.

Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar

09/16/2024 | BUSINESS WIRE
Omni Design Technologies, a leading provider of high-performance, low-power data acquisition and signal-processing solutions, and Aura Intelligent Systems, a developer of high-resolution imaging radar for ADAS and autonomous vehicles, announced a partnership on Aura’s next generation digital radar development.

Comtech Launches New Digital Common Ground Modem Product Line for DoD and Coalition Customers

09/13/2024 | BUSINESS WIRE
Comtech, a global technology leader, today announced the launch of the Company’s new Digital Common Ground (“DCG”) portfolio of modems.

AST SpaceMobile Announces Successful Orbital Launch of Its First Five Commercial Satellites

09/13/2024 | BUSINESS WIRE
AST SpaceMobile, Inc., the company building the first and only space-based cellular broadband network accessible directly by everyday smartphones designed for both commercial and government use, announced the successful launch of its first five commercial satellites, called BlueBirds.
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