UHDI Fundamentals: UHDI Applications for Aerospace
August 13, 2024 | Anaya Vardya, American Standard CircuitsEstimated reading time: 1 minute
Ultra high density interconnect (UHDI) technology refers to advanced manufacturing processes used to create extremely compact and highly efficient electronic circuits at the sub-1-mil line and space level. In aerospace applications, UHDI is crucial due to the stringent requirements for weight, reliability, and performance in a challenging environment. Here are some specific aerospace applications of UHDI:
- Avionics systems: UHDI is used in avionics systems to create compact, lightweight, and reliable printed circuit boards. This includes flight control, navigation, communication, and monitoring systems.
- Satellite technology: Satellites require highly reliable and compact electronic systems. UHDI technology is used to build these systems, ensuring they can withstand the harsh conditions of space.
- Unmanned aerial vehicles (UAVs): UAVs, including drones, benefit from UHDI technology in their guidance, communication, and payload management systems, where space and weight savings are critical.
- Radar systems: Radar systems used in both civilian and military aerospace applications require high-performance electronics. UHDI technology allows for creating complex radar systems with improved performance and reliability.
- Power management systems: Efficient power management is crucial in aerospace applications. UHDI technology helps develop compact and efficient power management systems that can handle the high power demands of modern aircraft.
- In-flight entertainment and connectivity: UHDI is used in the development of advanced in-flight entertainment and connectivity systems, which require high-density electronics to deliver robust performance while minimizing weight and space.
- Control systems: Flight control and engine control systems use UHDI technology to integrate multiple functions into a compact space, enhancing performance and reliability.
- Environmental control systems: These systems, which manage temperature, pressure, and air quality in aircraft, benefit from the compact and reliable nature of UHDI technology.
- Missile and defense systems: In military applications, UHDI technology is used in missile guidance and defense systems where high performance and reliability in extreme conditions are essential.
The implementation of UHDI technology in aerospace ensures that electronic systems are as efficient, lightweight, and reliable as possible, meeting the increasingly rigorous demands of the industry.
This article originally appeared in the August 2024 issue of Design007 Magazine.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Real Time with... SMTAI 2025: SPEA Bridges the Gap Between Legacy and Next-Generation Test Solutions
11/10/2025 | Real Time with...SMTAIEstablished in Italy in 1976, SPEA designs and manufactures automatic test equipment for various industries, including automotive, aerospace and defense, medical, consumer electronics, and energy. Recognized as one of Italy’s top-performing companies, SPEA continues to innovate in test automation technology. At SMTAI 2025, Dustin Warren, vice president of sales for SPEA America, discussed how the company is bridging the gap between older in-circuit test (ICT) systems and newer, more advanced testing solutions.
Lockheed Martin Revolutionizes AI Integration with STAR.OS™
11/08/2025 | Lockheed MartinLockheed Martin has made a major breakthrough in artificial intelligence (AI) technology with the introduction of the STAR.OS™ solution, a powerful new tool that enables different AI systems to work together smoothly and effectively.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
UHDI Fundamentals: UHDI Technology and Automated Inspection
11/03/2025 | Anaya Vardya, American Standard CircuitsFollowing up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.
OSI Systems Reports Fiscal Q1 2026 Financial Results
10/31/2025 | BUSINESS WIREOSI Systems, Inc. announced its financial results for the first quarter of fiscal 2026.