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Tide Rock Grows Electronics Recycling Portfolio with Global Electronic Recycling (GER) Acquisition
August 14, 2024 | PRNewswireEstimated reading time: 1 minute
Tide Rock, an unlevered buyout firm with a portfolio of diverse economically resilient B2B businesses, acquired Global Electronics Recycling (GER), a Phoenix-based professionalized IT Asset Disposition (ITAD) and electronics recycling company serving enterprise customers.
The acquisition further expands Tide Rock's portfolio of electronics recycling companies, complementing the acquisition of Full Circle Electronics in 2022 and Sipi's IT Asset and Disposition assets in 2023. GER will be integrated with Full Circle Electronics' business to boost their shared mission to transform the enterprise electronics recycling space.
"The addition of GER further bolsters the national footprint we established in the electronics recycling space with the growth of Full Circle Electronics over the last two years," said Mark Papp, President of Tide Rock YieldCo West Coast. "The companies have several immediate synergies that mutually benefit enterprise customers and prospects, particularly in the communications and aerospace and defense industries."
Tracey Haslam, CEO of Full Circle Electronics, will lead the integration of GER into Full Circle Electronics and will continue to lead the business going forward.
"Our mission has always been to better serve the growing IT and electronics asset disposition market by providing a safe, secure, and sustainable electronics recycling solution, and we certainly see that same mission reflected in the GER business," said Haslam. "Our combined services will better serve enterprise customers, large and small, across industries in the Phoenix area and further scale opportunities nationwide."
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STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
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TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
09/16/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB West 2025, taking place Wednesday, October 1, 2025, at the Santa Clara Convention Center in California. Visitors are invited to Booth 113 to explore the companies’ complementary expertise in test engineering services and workforce development for the electronics industry.