-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
NextFlex Names Dr. Gamota as Incoming Executive Director
August 15, 2024 | NextFlexEstimated reading time: 3 minutes

NextFlex, America’s Hybrid Electronics Manufacturing Innovation Institute focused on additive microelectronics manufacturing for novel applications and complex integrated systems, announced the appointment of Dr. Daniel Gamota, a well-known and experienced manufacturing and technology executive, to lead NextFlex into its next chapter as Executive Director, effective September 1, 2024. Dr. Gamota succeeds Dr. Malcolm Thompson, the inaugural Executive Director of NextFlex.
NextFlex leads a consortium of companies, academic institutions, non-profits, state and local governments, and federal government agencies that collaborate to advance the technology, manufacturing, and commercialization of hybrid electronics, to establish a sustainable domestic manufacturing ecosystem in support of the technology, and to accelerate the growth of the current and future manufacturing workforce. Established in 2015 in San Jose, CA, NextFlex is a public-private partnership supported by the U.S. Department of Defense under a Cooperative Agreement with Air Force Research Laboratory (AFRL) and is part of the Manufacturing USA® network.
“On behalf of NextFlex, I’m delighted to announce Dr. Gamota’s appointment to lead the NextFlex Manufacturing Innovation Institute into its next phase. Having been an active and long-standing member of NextFlex through his role at Jabil, Dr. Gamota consistently demonstrates his strategic support for the mission of the Institute and its members and partners,” said Dr. Robert Smith, Boeing Executive Technical Fellow, and Chair of the NextFlex Governing Council. “Hybrid electronics technology is at a critical inflection point – as it increasingly is integrated into volume manufacturing for both commercial and defense applications, it’s more important than ever that NextFlex continues to align the manufacturing ecosystem and accelerate the growth of the workforce of tomorrow.”
Dr. Gamota has more than 25 years of experience leading large organizations such as Jabil, where he served as Vice President, and Motorola, where he served as Director & Fellow of the Technical Staff, both of which industrialized innovative products and deployed advanced microelectronics manufacturing operations to international high volume production sites. He is recognized for leading R&D and collaborative innovation teams spanning Semiconductor Foundry (middle end of line and backend of the line), Semiconductor Assembly, Packaging & Test, Complex Integrated Systems Assembly, and Printed Circuit Board Assembly operations. Dr. Gamota is a proven P&L leader of global engineering, operations, and business teams that developed, deployed, and sustained microelectronics-based product manufacturing that resulted in revenue growth, expanded margins, and increased free cash flow.
Dr. Gamota has a strong record being awarded and leading several multi-member microelectronics systems solutions development programs (DARPA, NIST ATP, etc.). He is a member of the SEMI Board of Industry Leaders, University of Michigan MSE External Advisory Board, and San Jose State University Engineering Industry Advisory Council, providing strategic technology, market, and workforce development guidance. Also, Dr. Gamota is active in and has chaired committees developing microelectronics guidelines, standards, and roadmaps for IEEE, iNEMI, IPC, IEC, A*STAR, and SEMI.
Dr. Gamota was elevated to a NextFlex Fellow, IEEE Fellow, and was named a Dan Noble Fellow at Motorola for his contributions and leadership in microelectronics design, materials, packaging, processes, manufacturing, assembly, and testing. He earned a Ph.D. in engineering from the University of Michigan and a Master of Business Administration from the Kellogg School of Management at Northwestern University.
“I am excited to lead NextFlex as it evolves to become an engine for product industrialization and commercialization of a portfolio of innovations, a pipeline for talented workforce, and a strategic partner to volume manufacturing services providers and OEMs. NextFlex has the foundational tenets - talent, funding, programs, operational structure, and facility - to ensure it continues to be globally recognized as the nexus for Hybrid Electronics innovation,” said Dr. Gamota. “I believe that NextFlex must continue to demonstrate agility in navigating the multidimensional complexities impacting the Electronics Manufacturing Ecosystem: workforce, supply chain resiliency, sustainability, and technology innovation. I also look forward to leading the NextFlex community as it continues to foster strong collaboration with Ecosystem members that represent diverse industry, academic, and government groups driving key enabling R&D topics.”
Dr. Gamota’s appointment marks the beginning of NextFlex’s tenth year of operations. During this time, NextFlex has grown its membership to more than 210 organizations, managed over $400M in 240 technology and manufacturing development projects, served more than 25,000 students around the country with its education and workforce development programs, established three regional U.S. nodes in Massachusetts, Missouri, and New York, outfitted an end-to-end pilot scale design, prototype and manufacturing facility in Silicon Valley, and produced annual technology and manufacturing roadmaps to guide and de-risk investment for the member community.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Marcy’s Musings: The Legislative Outlook: Helping or Hurting?
10/20/2025 | Marcy LaRont -- Column: Marcy's MusingsJust before we were ready to publish our October issue of PCB007 Magazine, some breaking news from the White House, unfortunately (but perfectly) parlayed into why the topic of this month’s issue has been so important to cover in great depth.
EMS Solutions Expands Workforce to Meet Rising Demand for U.S.-Based Electronics Manufacturing
10/17/2025 | EMS SolutionsEMS Solutions, a premier regional provider of Electronics Manufacturing Services (EMS), has announced several new hires across key departments as the company continues to grow its capabilities and meet increasing customer demand.
Jabil Announces Board Transitions
10/17/2025 | JabilJabil Inc. announced that Executive Chairman of the Board of Directors Mark T. Mondello and Directors Kathleen A. Walters and Jamie Siminoff will not seek re-election at Jabil’s Annual Meeting of Stockholders in January 2026.
StenTech Strengthens Precision Parts Platform with AME Acquisition
10/17/2025 | StenTechStenTech, North America’s leading provider of SMT printing solutions and precision manufacturing, has announced the acquisition of Advanced Metal Etching, Inc. (AME), a recognized specialist in chemically etched and laser cut precision parts.
MKS’ Atotech, ESI to Participate in TPCA Show & IMPACT Conference 2025
10/17/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.