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Infineon Pioneers World’s First 300 mm Power Gallium Nitride (GaN) Technology

09/16/2024 | Infineon
Infineon Technologies AG announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology.

NATO Support and Procurement Agency Contracts SES’s O3b mPOWER for Secure Communications Services

09/13/2024 | BUSINESS WIRE
The NATO Support and Procurement Agency (NSPA) has awarded SES a contract to deliver secure high-performance low-latency satellite services via its medium earth orbit (MEO) constellation, enabling global missions for NATO member government organisations, agencies and military.

MEK Launches New PowerSpector JSAz 550: Larger 3D Desktop AOI System with New Chassis

09/11/2024 | MEK
Mek (Marantz Electronics), a leader in Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) technology, proudly announces the launch of its latest product, the PowerSpector JSAz 550. This new selective 3D desktop AOI system is a larger L-size model, capable of accommodating Printed Circuit Boards (PCBs) up to 550x550mm (21.7”x21.7”).

Sondrel Announces Advanced Modelling Process for AI Chip Designs

09/10/2024 | Sondrel
Sondrel, a leading provider of ultra-complex custom chips for leading global technology brands, has announced an Advanced Modelling Process for AI chip designs.

Qualcomm Expands Performance Leadership to More Copilot+ PC Users with New Snapdragon X Plus 8-core

09/10/2024 | Qualcomm Technologies, Inc.
Ahead of IFA 2024, Qualcomm Technologies, Inc. announced the expansion of its Snapdragon X Series portfolio with the introduction of Snapdragon® X Plus 8-core, a breakthrough platform that unleashes multiday battery life, unprecedented performance and AI-powered Copilot+ experiences to even more people.
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