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AMD and Fujitsu to Begin Strategic Partnership to Accelerate Open-Source AI Initiatives

11/01/2024 | AMD
AMD and Fujitsu Limited today announced that they have signed a memorandum of understanding (MOU) to form a strategic partnership to create computing platforms for AI and high-performance computing (HPC). The partnership, encompassing aspects from technology development to commercialization, will seek to facilitate the creation of open source and energy efficient platforms comprised of advanced processors with superior power performance and highly flexible AI/HPC software and aims to accelerate open-source AI and/or HPC initiatives.

Siemens, CELUS Collaborate to Empower SMBs with AI-powered PCB Design

10/30/2024 | Siemens
Siemens Digital Industries Software, a global leader in PCB electronic systems design, and CELUS, a pioneer in AI-powered electronic design automation solutions, announced their collaboration to transform the PCB design landscape for small and medium-sized businesses (SMBs) and independent engineers.

onsemi East Fishkill Fab Accredited as Trusted Foundry by Department of Defense

10/29/2024 | BUSINESS WIRE
onsemi announced its wafer fab in East Fishkill (EFK), New York, has been accredited by the Defense Microelectronics Activity (DMEA) of the U.S. Department of Defense (DoD) as a Category 1A Trusted Supplier.

RTX's Collins Aerospace Develops High-Voltage Power Components for Clean Aviation Project

10/29/2024 | RTX
Collins Aerospace, an RTX business, has completed prototype development of a solid-state power controller and power distribution panel as part of the SWITCH project, supported by the European Union's Clean Aviation Joint Undertaking (Clean Aviation).

TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems

10/28/2024 | ANSYS
Ansys was recognized at the TSMC 2024 Open Innovation Platform® (OIP) Partner of the Year awards for excellence in design enablement for AI, HPC, and photonics silicon systems.
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