The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
Worldwide Automotive Semiconductor Market to Exceed US$88 Billion by 2027
August 19, 2024 | IDCEstimated reading time: 2 minutes
The global automotive semiconductor market is on track to surpass $88 billion by 2027, driven by the surging demand for high-performance computing (HPC) chips, graphics processing units (GPUs), radar chips, and laser sensors. This growth is fueled by the increasing adoption of the advanced driver assistance system (ADAS), electronic vehicles (EVs), and Internet of Vehicles (IoV), bringing new growth opportunities for the automotive semiconductor sector, according to a recent report titled 2023 Worldwide Competitive Landscape of Automotive Semiconductor.
IDC predicts that as the value of semiconductors per vehicle continues to rise, semiconductor companies will become increasingly critical to the automotive supply chain.
Leading semiconductor companies such as Infineon, NXP, STMicroelectronics, Texas Instruments (TI), and Renesas Electronics are investing heavily in developing solutions for next-generation microcontrollers, system on a chip (SoC), and high-resolution radars. To meet the needs of automobiles for higher volume, higher performance, and higher safety of semiconductors, they continuously enhance ADAS, autonomous driving systems, and cockpit and networking features and integrate complex electronic control units (ECUs) and sensor fusion technology.
According to International Data Corporation (IDC)'s recently released report, 2023 Worldwide Competitive Landscape of Automotive Semiconductor ( Doc #US50917724 , July 2024), the top five vendors in the automotive semiconductor market captured over 50% of the market share in 2023. Infineon led the market with a share of 13.9%; it was followed by NXP and STMicroelectronics, holding a market share of 10.8% and 10.4%, respectively; TI and Renesas Electronics also demonstrated strong performance, accounting for 8.6% and 6.8%, respectively, of the total share. The market landscape is as follows:
- Through ongoing technological innovation, strategic acquisitions, robust supply systems, and close cooperation with automotive original equipment manufacturers (OEMs), Infineon consistently elevated its market position in the field of power electronics and advanced control systems, establishing itself as a leader in the power semiconductor market.
- NXP possesses deep expertise in vehicle-to-everything (V2X) communication and security technologies and continually innovates and iterates. It is a frontrunner in this field as a supplier of comprehensive product solutions through close cooperation with automotive OEMs and Tier 1 suppliers.
- STMicroelectronics offers innovative solutions for the automotive industry by virtue of its specialization in micro-electromechanical systems (MEMS) and power semiconductors.
- TI, with a wide range of analog chips and embedded solutions, delivers product portfolios that meet customers' needs. Meanwhile, it has a robust supply chain management and product quality management system to support it.
- Renesas Electronics offers a comprehensive collection of microprocessors and SoCs to ensure functional safety and reliability. Meanwhile, it employs strategic acquisitions and cooperation to maintain its leading edge in the industry.
Advancements in the automotive sector have fueled the demand for high-performance, high-safety semiconductors. As EVs and autonomous driving technologies evolve, those semiconductor companies will continue to play a key role in the global automotive semiconductor market.
According to Adela Guo, Research Director at IDC Asia Pacific, “The common strengths of these leading semiconductor vendors include substantial R&D investment and strong technological leadership, comprehensive product portfolios, solid strategic partnerships, efficient global operations, as well as safe and reliable product performance. These features empower them to stay ahead of the competition and propel the sustainable development of the automotive sector towards electrification, networking, and intelligence.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.