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IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

09/16/2024 | IPC
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”

Impact of the Altium-Ansys Partnership on PCB Design

09/05/2024 | Josh Moore, Altium
There’s a saying in electronics hardware design: “There are two types of electronics designers: those who have signal integrity problems and those who will.” This adage emphasizes the inevitability of encountering and the need to address signal integrity (SI) and power integrity (PI) issues.

Inside Information, Profit Warning: Aspocomp Lowers Guidance for 2024

08/29/2024 | Aspocomp
Aspocomp Group Plc lowers its financial guidance for the year 2024. Aspocomp now estimates that its net sales for 2024 will be below the 2023 level, and its operating result for 2024 will be clearly below the 2023 level. In 2023, net sales amounted to EUR 32.3 million and the operating result was a loss of EUR 1.7 million.

Nordson Electronics Solutions to Exhibit at SEMICON Taiwan 2024

08/28/2024 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516. 

Hon Hai Publishes Environmental Management Manual and Zero-Waste Certificate Map

08/16/2024 | Foxconn
Hon Hai Technology Group continues to promote the concept of “EPS+ESG = sustainable management” and spares no effort. During the ESG theme month “Hon Hai Environment Month”, for the first time, the group’s “Environmental Management Manual” was published to the public.
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