Flexible Thinking: Rules of Thumb—A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Advanced Packaging: Preparation is Now
November 20, 2024 | Nolan Johnson, SMT007 MagazineEstimated reading time: 2 minutes
A new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Nolan Johnson: Your white paper on advanced packaging is a very technically deep, insightful piece with great detail. What's the ultimate goal?
Matt Kelly: Our intent was to go one layer deeper into our silicon-to-systems messaging. You've heard this phrase as a way to describe what's happening at the front end of the supply chain, from chips to the final system. The report begins by talking about applications. It's important to understand that advanced packaging is very broad, so we break down what it means to drive market segments.
For example, advanced packaging means different things in different applications, such as high-performance computing (HPC), 5G/6G wireless communications, autonomous driving and EV automotive, medical electronics, and aerospace and defense systems. Depending on the type of environment and product you're dealing with, the challenges, needs, and requirements for what these advanced packaging techniques can deliver will vary.
This report is important because it combines two concepts—component-level packaging (CLP) and system-level packaging (SLP)—which are obviously related.
It’s important to convey that the amount of time, effort, and investment IPC has made to stay on top of changes with advanced packaging will be ongoing and is here to stay. A long time ago, someone taught me that “everything follows silicon”; just watch what it does, and everything else will follow. That lesson holds true here, too. People are already doing a lot of this work. Products and devices are using this technology as we speak. This is not “someday”; it's actually happening now. But as with everything else, there's breadth to this for the entities unaware of these challenges. We know it’s important for our membership and the industry that we stay on top of this.
To read the continue reading this article, which originally appeared in the November 2024 SMT007 Magazine, click here.
Share on:
Suggested Items
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
12/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
The Knowledge Base: The Era of Advanced Packaging
12/23/2024 | Mike Konrad -- Column: The Knowledge BaseThe semiconductor industry is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physical and economic barriers, transistor density can no longer double every two years without escalating costs and complications. As a result, the industry is shifting its focus from chip-level advancements to innovative packaging and substrate technologies. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight.
Toray Engineering Launches TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging
12/17/2024 | ACCESSWIREToray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers and data centers. Sales of the TRENG-PLP Coater will commence in December 2024.
Global Semiconductor Market to Grow by 15% in 2025, Driven by AI
12/13/2024 | IDCThe global demand for artificial intelligence (AI) and high-performance computing (HPC) will continue to rise, growing by over 15% in 2025, according to IDC ’s latest Worldwide Semiconductor Technology Supply Chain Intelligence report. Major application markets, ranging from cloud data centers to specific industry segments, are expected to undergo upgrades, heralding a new boom for the semiconductor industry.