Moving from Surviving to Thriving
August 19, 2024 | Mark Wolfe, IPCEstimated reading time: 1 minute
A few months ago, I shared some thoughts regarding the implications of the survival mode that most of us have lived in, at least for the past several years, within the electronics supply chain. In this article, I would like to share some additional thoughts about how companies can move away from merely surviving and work toward thriving across their supply chain. At a high level, here is what I believe the foundation of thriving looks like:
It is centered around open, honest, and transparent communication.
- All parties should work to understand the other’s perspectives first.
- You should always try to assume that intentions are good even when it doesn’t feel that way.
- Bad news is shared just as quickly as good news in both directions.
- When suppliers don’t “win” (short term opportunities), help them understand why not.
- It should also involve long-term perspectives.
- When mistakes happen, work to focus on “what happened?” not “who did it?”
- Try to learn from mistakes and determine how to eliminate them in the longer term.
- Commit energy to long-term strategic conversations with your key suppliers.
Commit to and trust that all parties want everyone to win (over the long term).
To read this entire article, which appeared in the August 2024 issue of SMT007 Magazine, click here.
Suggested Items
Understanding Cleaning Challenges for Automated Solder Paste Dispensing
09/18/2024 | Debbie Carboni, KYZENIn today’s rapidly evolving electronics manufacturing landscape, staying abreast of innovative technologies is crucial. As solder paste and substrate materials continually evolve and become more complex, optimizing production methods with the latest technology ensures performance and quality while reducing operational costs.
IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
09/16/2024 | IPCThe increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
Impact of the Altium-Ansys Partnership on PCB Design
09/05/2024 | Josh Moore, AltiumThere’s a saying in electronics hardware design: “There are two types of electronics designers: those who have signal integrity problems and those who will.” This adage emphasizes the inevitability of encountering and the need to address signal integrity (SI) and power integrity (PI) issues.
Inside Information, Profit Warning: Aspocomp Lowers Guidance for 2024
08/29/2024 | AspocompAspocomp Group Plc lowers its financial guidance for the year 2024. Aspocomp now estimates that its net sales for 2024 will be below the 2023 level, and its operating result for 2024 will be clearly below the 2023 level. In 2023, net sales amounted to EUR 32.3 million and the operating result was a loss of EUR 1.7 million.
Nordson Electronics Solutions to Exhibit at SEMICON Taiwan 2024
08/28/2024 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in