SMT Perspectives and Prospects: Artificial Intelligence, Part 4—Prompt Engineering
The Knowledge Base: My 2025 Industry Wish List
Global Sourcing Spotlight: The Surprising World of Offshore B2B Industrial Values
AI-Driven Evolution: ASMPT to Showcase Transformative Solutions at SEMICON Taiwan 2024
August 20, 2024 | ASMPTEstimated reading time: 2 minutes
ASMPT Limited, the world's leading provider of hardware and software solutions for the semiconductor and electronics industries, will be exhibiting at SEMICON Taiwan 2024, Asia's leading electronics manufacturing event, from 4-6 September. ASMPT will showcase its advanced systems, NUCLEUS XLplus, POWER VECTOR, and VORTEX II, across three zones covering AI, Smart Automotive, and Intelligent Factory solutions at Booth N0762, TaiNEX 1&2.
Fan-Out Packaging: Powering the AI Era
The AI revolution continues to push the boundaries of computing power, driving the demand for high-performance AI chips, which in turn is accelerating innovation in advanced packaging. The fan-out process is shaping the future of semiconductor manufacturing, and ASMPT is at the forefront of this trend with its high-density Fan-Out Panel-Level Packaging (FOPLP) solution designed for 2.5D, fan-out, and embedded packages. NUCLEUS XLplus is precisely engineered to meet SEMI 3D20 standards, and it delivers exceptional accuracy on SiP bonding and flexibility in the fan-out process. Capable of handling extra-large substrates up to 600 x 600 mm, the solution supports a wide range of packaging configurations, from flip-chip to direct die attach, which exemplifies ASMPT’s dedication to pioneering technology and innovation in the rapidly evolving advanced packaging industry.
Smart Automotive Solutions: Driving the Future
AI is widely adopted by electric vehicle manufacturers for advanced driver assistance systems, autonomous driving features, and predictive maintenance, enabling enhanced performance, safety, and efficiency. To meet the dynamic needs of the automotive sector, ASMPT will present a range of Smart Automotive solutions tailored for the industry, encompassing sensing tech, power management, connectivity, infotainment, and more. ASMPT will also present the SiC power and advanced display solution, empowering EV manufacturers to improve quality, reliability, and efficiency in their production operations.
POWER VECTOR - a die-tacking solution designed for Ag/Cu sintering in automotive power modules, offering strong bonding forces up to 588 N and process versatility. Coupled with ASMPT’s SiC power solution, manufacturers can create robust modules with enhanced electrical and thermal characteristics.
VORTEX II - designed explicitly for Mini LED Advanced Displays, efficiently handling Mini LED assembly and offering high-speed performance, exceptional precision, and innovative Zero-Delay XY-auto-correction, tending to transform visual experiences in modern vehicles with enhanced display quality and performances.
Intelligent Factory: Elevating Digital Transformation to New Heights
As the premier supplier of cutting-edge equipment and technological processes for the electronics industry, ASMPT enables electronics manufacturers worldwide to establish smart factories, championing automation and digitalisation. Through AI Enablement with machine learning algorithms incorporating the 4M framework (Man, Machine, Materials, Method), ASMPT solutions offer decision automation and optimisation, seamlessly integrating all operational levels from individual machines to production lines, factories, and enterprises. ASMPT’s comprehensive smart manufacturing solutions include SkyEye, the ecosystem for smart semiconductor manufacturing, and Intelligent Factory solutions, alongside its innovative SIPLACE placement and DEK printing solutions, as well as the modern Manufacturing Execution Systems (MES) from Critical Manufacturing will be displayed at SEMICON Taiwan. Together, this dynamic platform of advanced technologies will illustrate the latest automation and Digital Transformation advancements.
"ASMPT's presence at SEMICON Taiwan 2024 reflects our commitment to leading the industry with our developments and providing innovative solutions for semiconductor and electronics manufacturing. ASMPT will showcase its latest innovations in advanced packaging, smart automotive solutions and smart manufacturing, highlighting its leading role in semiconductor and electronics manufacturing technology. This will further strengthen our collaboration with our customers and partners and reinforce our role as a trusted industry leader that increases productivity, efficiency and competitiveness, " reassures Joseph Poh Tson Cheong, Senior Vice President at ASMPT.
Share on:
Suggested Items
StratEdge Partners with Vitale Engineering as Manufacturer's Representative for Upstate New York
01/22/2025 | StratEdgeStratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, has appointed Vitale Engineering as its exclusive Manufacturer’s Representative for Upstate New York. Known for their customer-focused approach and technical expertise,
Variosystems Strengthens Global Engineering Expertise
01/22/2025 | Variosystems AGVariosystems, the globally operating system provider for high-quality electronic solutions, reaches another milestone moment in the company's development. In opening of the global Engineering Service Center in Colombo, Sri Lanka, the company is expanding its engineering expertise to meet the demand for advanced services such as obsolescence management, electronics design and test development.
Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
01/22/2025 | Cadence Design SystemsCadence announced it has entered into a definitive agreement to acquire Secure-IC, a leading embedded security IP platform provider.
NovoLINC Secures Investments to Assist AI Computing with Groundbreaking Thermal Interface Technology
01/21/2025 | PRNewswireNovoLINC, a thermal technology startup spun out of Carnegie Mellon University, announced seed funding led by M Ventures, with participation from Foothill Ventures and TDK Ventures. NovoLINC's breakthrough nanocomposite thermal solutions reduce thermal resistance to an industry-record low (< 1mm²-K/W), according to company co-founders, CSO Prof. Sheng Shen and CTO Dr. Rui Cheng.
Technica USA and Renex Reach Agreement to Distibute REECO Brand of Products
01/21/2025 | Technica USATechnica is pleased to announce that we have entered into an exclusive distribution agreement with Renex for the REECO brand of ESD and cleanroom products. Technica will distribute the REECO products in the territories of California, Oregon, Idaho, Nevada, Arizona, New Mexico, Colorado, and Wyoming, as well as Washington and Utah (non-exclusively).