Foxconn Inaugurates Residential Housing Complex In Industrial Park In India
August 20, 2024 | FoxconnEstimated reading time: 1 minute
Foxconn and the state government of Tamil Nadu in India today inaugurated a new residential complex in Vallam Vadagal Industrial Park. The complex provides a sustainable living community for thousands of employees of the world’s largest manufacturing service provider.
Built by the State Industries Promotion Corporation of Tamil Nadu (SIPCOT), the complex is a first-of-its-kind initiative reflecting the state government’s commitment to attracting foreign investment while meeting investor needs. Designed as a women-only residential complex, it prioritizes employee well-being, safety, and diversity.
“This residential complex is a testament to our commitment to our employees and to India,” said Foxconn Chairman Young Liu. “It represents a significant step forward in our operations and contributes to the overall development of the region.”
Located 20 minutes from Foxconn’s mega manufacturing site, the multi-building complex offers amenities such as a laundromat, gym, recreational areas, and a cafeteria. It is the first industrial housing complex built by SIPCOT within an industrial park.
Foxconn’s India operations have achieved significant sustainability milestones, including Platinum-level UL2799 certification for Zero Waste to Landfill, construction of a zero liquid discharge sewage treatment plant, and implementation of energy-saving measures. The company has also completed third-party audits under the ERSA 3.0 electronics industry standard, demonstrating its commitment to environmental responsibility.
Suggested Items
Siemens Extends Veloce with Innexis Shift-Left Software
11/07/2024 | SiemensSiemens Digital Industries Software announced the Innexis product suite, a complement to its industry leading Veloce™ hardware-assisted verification and validation system.
Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
10/23/2024 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.
Absolute EMS Expands Capabilities to Support the AI Industry with High-Complexity, High-Reliability PCB Assembly Services
10/08/2024 | Absolute EMS, Inc.Absolute EMS, Inc., a four-time award-winning EMS provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is proud to announce its enhanced printed circuit board assembly (PCBA) capabilities tailored to the fast-growing artificial intelligence
Rocket Lab Successfully Completes Latest Launch with Capella Space
08/12/2024 | BUSINESS WIRERocket Lab USA, Inc., a global leader in launch services and space systems, successfully launched its 52nd Electron rocket and deployed a single satellite to low Earth orbit for Capella Space (Capella).
Ian Walsh Appointed as Sondrel’s Regional VP for America
07/23/2024 | SondrellSondrel, a leading provider of ultra-complex, custom chips for leading global technology brands, has appointed Ian Walsh as its Regional VP for America, with the responsibility of growing Sondrel’s US semiconductor business from its new Silicon Valley offices in Santa Clara, CA.