Cost-optimize Your PCB Design and Specifications
August 20, 2024 | Erik Pedersen and Richard Koensgen, ICAPE GroupEstimated reading time: 1 minute
Knowledge is the key to identifying the small details that makes the big cost difference for your printed circuit board. There are many types of printed circuit boards and multiple choices between the development of schematic and BOM to PCB technology selection, electronic PCB design, mechanical and physical properties, and PCB specification.
Component Technology and BGA Size
The component size and technology have the most significant influence on the PCB cost. Most surface-mounted microchips can be designed into standard PCBs with plated through-holes. If the same microchip comes in a BGA package, it might need microvias and buried vias using a higher wiring density to be designed into an HDI PCB. Generally, PCBs containing BGAs become HDI PCBs when the ball center-to-center pitch is below 0.8 mm. If your physical board properties allow it and the component availability is equal, you should strive to find the BGA with the largest pitch to reduce the component and PCB cost.
For example, the same BGA microchip can be found with pitch 0.8 mm, 0.6 mm, and 0.5 mm. The 0.8 mm pitch BGA can be routed on an eight-layer standard PCB with a price index of 100. The 0.6 mm pitch can be routed on a (1-6-1) eight-layer, one-step HDI PCB with a price index of 200. The 0.5 mm pitch BGA can be routed on a (2-4B-2) eight-layer, three-step HDI PCB with a price index of 350. The number of lamination steps is the most significant cost driver for HDI and ultra HDI PCBs. Designs with BGAs equal to or less than 0.4 mm and multiple rows challenge the capability of HDI suppliers, which leads to the use of UHDI design parameters and thereby reduces the availability and increases the cost.
Material Selection
Correct material selection that complies with the performance and functionality of your application also plays a crucial role in the PCB cost.
The most common stackups of standard PCBs are specified with 35 µm Cu on all layers. The manufacturer starts on 17.5 µm Cu on outer layers and 35 µm Cu on inner layers, since the final outer layer Cu thickness reaches approximately 35 µm after plating. But 35 µm Cu on the inner layers isn’t always required and can be replaced by 17.5 µm for the current flowing in many electronic devices. This, in turn, lowers costs.
To continue reading this article, which originally published in the August 2024 Design007 Magazine, click here.
Suggested Items
LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
04/24/2025 | LITEON TechnologyLITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
04/24/2025 | John Watson -- Column: Elementary, Mr. WatsonOn a flight, I can always tell when we begin our descent because that subtle drop in my stomach tells me the altitude has changed. Landing an airplane involves a gradual, precise process called the glide path. It descends at the correct speed and 3-degree angle to touch down smoothly and safely on the runway without bouncing or coming to a sudden stop. Pilots use specialized tools like the Instrument Landing System (ILS) or GPS to stay on the correct path. Lights on the ground, called PAPI lights, help pilots know if they are too high or too low.
Explore Thermal Management Solutions in Latest Podcast Series—New Episode Now Available
04/23/2025 | I-Connect007I-Connect007 is excited to share the latest episode in our new podcast series! In this episode, Ryan returns to discuss practical strategies for managing heat, starting early in the design planning and specification phases. After all, prevention means there’s less to mitigate later.
Real Time with... IPC APEX EXPO 2025: IPC's Growth and Future in India's Manufacturing Sector
04/23/2025 | Real Time with...IPC APEX EXPOGaurab Majumdar, VP for IPC in SE Asia and India, highlights IPC's impressive growth in India, with certification numbers rising significantly. The Indian manufacturing sector is projected to reach a $300 billion market, alongside a $10 billion investment in semiconductors. IPC is addressing industry demands through standards development and a new workforce project aimed at training students for job placements.
Real Time with... IPC APEX EXPO 2025: DuPont Electronics Materials and Innovations
04/23/2025 | Real Time with...IPC APEX EXPODuPont is many things to many markets, but DuPont Electronics Materials is, perhaps, a bit out of the DuPont "norm," developing specialized electronic materials that are particularly focused on challenging areas such as flex circuits, high power PCBs and products that must withstand harsh environments. At IPC APEX EXPO, Marcy LaRont sat down with Shannon Dugan from DuPont Electronics Materials to discuss some big news. They are being spun off into an independent entity with a new CEO having just been announced as the show wrapped.