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ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation

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Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. and a leading provider of semiconductor assembly and test services, announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies.

Semiconductor Packaging Materials Market to Hit $93.7B by 2031, Driven by AI and Chiplet Demand

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What Heterogeneous Integration Means for EMS Providers

05/14/2026 | Nolan Johnson, I-Connect007
Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.
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