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CEE PCB Appoints Jerome Larez to Field Application Engineer North America
August 26, 2024 | CEE PCBEstimated reading time: Less than a minute
Tom Yang, CEO of CEE PCB, has appinted industry veteran Jerome Larez to the position of Field Application Engineer (FAE) North America.
Mr. Larez has held several technical sales positions with printed circuit board companies, most recently with MicroConnex corporation. He started his career in the industry with Prototron Circuits in their Tucson facility and later the Redmond division. His career has crossed both engineering and sales, making him an ideal candidate for the new FAE position.
Mr. Yang said, “Jerome brings a depth of technical and sales knowledge as well as a great deal of experience in the North American PCB market. His experience, energy and passion for helping customers is exactly what we are looking for as we enter the North American PCB market.”
Added Mr. Larez, “I am looking forward to this new chapter in my life. The capabilities and technologies that CEE PCB brings to the market is something that I was really looking for in my next company. I am very optimistic about this new venture with CEE PCB.”
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