Flexible Thinking Flexible Circuit Technology—Looking Back and Forward
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
CEE PCB Appoints Jerome Larez to Field Application Engineer North America
August 26, 2024 | CEE PCBEstimated reading time: Less than a minute
Tom Yang, CEO of CEE PCB, has appinted industry veteran Jerome Larez to the position of Field Application Engineer (FAE) North America.
Mr. Larez has held several technical sales positions with printed circuit board companies, most recently with MicroConnex corporation. He started his career in the industry with Prototron Circuits in their Tucson facility and later the Redmond division. His career has crossed both engineering and sales, making him an ideal candidate for the new FAE position.
Mr. Yang said, “Jerome brings a depth of technical and sales knowledge as well as a great deal of experience in the North American PCB market. His experience, energy and passion for helping customers is exactly what we are looking for as we enter the North American PCB market.”
Added Mr. Larez, “I am looking forward to this new chapter in my life. The capabilities and technologies that CEE PCB brings to the market is something that I was really looking for in my next company. I am very optimistic about this new venture with CEE PCB.”
Share on:
Suggested Items
Technica USA Showcases PCBA Supply Partners at IPC APEX EXPO 2025
03/13/2025 | Technica USATechnica USA is thrilled to highlight its full portfolio of PCBA supply partners at the 2025 APEX/IPC Expo in Anaheim, California. Featuring some of the world’s leading suppliers, Technica’s PCBA product lineup continues to drive innovation and excellence in the industry.
Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025
03/13/2025 | AismalibarAismalibar, a global leader in high-performance thermal management materials, is set to exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).
Technica USA Celebrates 40 Years of Excellence in Electronics Manufacturing
03/13/2025 | Technica USATechnica USA, a leading provider of materials, equipment, installation, and services for the printed circuit board (PCB) fabrication, PCB Assembly, substrates, MEMS, and semiconductor industries, proudly announces its 40th anniversary in 2025.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
MicroCraft to Unveil Three New Models at IPC APEX EXPO 2025
03/12/2025 | MicroCraftMicroCraft, a global leader in PCB testing and precision inkjet printing solutions, is set to showcase three cutting-edge models at IPC APEX EXPO 2025 at the Anaheim Convention Center March 18-20 in booth #4105. Each model represents the latest advancements in speed, accuracy, and automation across MicroCraft’s three product lines.