Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
CEE PCB Appoints Jerome Larez to Field Application Engineer North America
August 26, 2024 | CEE PCBEstimated reading time: Less than a minute
Tom Yang, CEO of CEE PCB, has appinted industry veteran Jerome Larez to the position of Field Application Engineer (FAE) North America.
Mr. Larez has held several technical sales positions with printed circuit board companies, most recently with MicroConnex corporation. He started his career in the industry with Prototron Circuits in their Tucson facility and later the Redmond division. His career has crossed both engineering and sales, making him an ideal candidate for the new FAE position.
Mr. Yang said, “Jerome brings a depth of technical and sales knowledge as well as a great deal of experience in the North American PCB market. His experience, energy and passion for helping customers is exactly what we are looking for as we enter the North American PCB market.”
Added Mr. Larez, “I am looking forward to this new chapter in my life. The capabilities and technologies that CEE PCB brings to the market is something that I was really looking for in my next company. I am very optimistic about this new venture with CEE PCB.”
Share on:
Suggested Items
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
The Right Blend: Mixed Wireless Technologies
05/08/2025 | Kirsten Zima, Siemens EDAA common trend recently is to employ as many radios as possible on a single PCB. With the increase of wireless standards and the downscaling of PCB size, it can be difficult to know what the most critical design parameters are to focus on. In this article, we’ll discuss the most important considerations to make when designing with mixed wireless technologies, such as Bluetooth, GPS, and Wi-Fi, on a single PCB. These considerations include antennas, frequencies, FCC compliance, shielding, and layout with and without transition vias.
Navigating Global Manufacturing in an Era of Uncertainty
05/07/2025 | Philip Stoten, ScoopThe EMS industry faces unprecedented challenges as global trade tensions rise and tariff announcements create market uncertainty. In an overview of IPC Europe’s podcast, MADE IN EUROPE, industry experts from GPV and Zollner examine how these developments impact our businesses and customers, and what strategies will prevail in this new landscape.
Voices of the Industry: Alpha Circuit
05/06/2025 | Marcy LaRont, PCB007 MagazinePrashant Patel, founder and president of Alpha Circuit, takes a pragmatic approach to doing business: “Commerce always wins out,” he says. How will potential tariffs and shifts in the economy affect PCB manufacturing? Prashant offers sound advice.