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Nordson Electronics Solutions to Exhibit at SEMICON Taiwan 2024
August 28, 2024 | Nordson Electronics SolutionsEstimated reading time: Less than a minute
Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.
On display will be the ASYMTEK Forte® fluid dispensing system, configured for high productivity and accuracy for many semiconductor packaging and microelectronics manufacturing applications. The Forte system is ideal to tackle high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.
Other featured technologies include developments for high-throughput panel-level packaging (PLP) and wafer-level packaging (WLP), and handling the challenges of warpage during fluid dispensing operations. Presentations will be available to show different configurations for WLP and PLP on the ASYMTEK Vantage® fluid dispensing system, and how these systems can successfully ensure precise dispense results with high throughput.
Experts will be ready to discuss how Nordson can support your manufacturing of reliable semiconductor products. SEMICON Taiwan will be held at TaiNEX, Taipei Taiwan, September 4-6, 2024.
Especially for wafer-level and panel-level packaging, these technologies ensure high-throughput, precise dispense results within the same footprint as current equipment.
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IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
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From Silicon to Systems
09/10/2024 | Andy Shaughnessy, Design007 MagazineFor the past few years, IPC has been championing the term “silicon to systems.” More than a buzzword, it has become a slogan—and even a kind of roadmap—for the organization. The term comes in especially handy when IPC is advocating for this industry in Washington, D.C., often addressing politicians who have little understanding of electronics technology.
CoWoS Drives Demand for Advanced Packaging Equipment; Sales Expected to Surpass 10% Growth in 2024
08/29/2024 | TrendForceTrendForce reveals that sales of advanced packaging equipment are expected to grow by more than 10% in 2024, with the potential to exceed 20% in 2025.
Why You Need to Take This New ‘Semiconductor Essentials’ Course
08/26/2024 | I-Connect007 Editorial TeamRecently, Andy Shaughnessy and Nolan Johnson met with Soo Lan Cheah, the developer of a new IPC course geared toward PCB manufacturing professionals who have little to no knowledge about semiconductor manufacturing. With her background in PCB and IC design, Soo Lan brings a circumspect vision of these disciplines and how they are inter-related. You don’t need to know a lot of math to take this course, and you’ll come out with a much better understanding of the whole silicon-to-systems approach.
Pre-registration Now Open for NEPCON ASIA 2024: Experience the Future of Electronics Manufacturing
08/23/2024 | PRNewswireNEPCON ASIA 2024, one of the most influential events in electronics manufacturing, organized by RX Shenzhen, will take place from November 6-8, 2024, at the Shenzhen World Exhibition & Convention Center (Bao'an).