Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
IPC’s Road to Reliability Webinar Series Covers New e-Mobility Technologies
August 28, 2024 | IPCEstimated reading time: 1 minute
Starting September 12, IPC’s Road to Reliability Webinar series will bring industry leaders together to discuss the hurdles in achieving reliability for new e-mobility technology. Speakers will examine reliability drivers, technology applications, and target lifecycles in each free webinar.
- On September 12, 10 am CDT, Habib Mustain, Hereaus, will discuss power electronic substrate types, requirements, and challenges for today's EV applications and will address essential topics related to the use of power substrates in power electronic applications with an emphasis on EVs. Stan Rak, SF Rak Company, will serve as webinar moderator. Learn more and register.
- On October 17, 10 am CDT, Brian O'Leary, Indium Corporation, will discuss the impact of the software defined vehicle on hardware design and manufacture. In addition, he will cover how automakers and system designers are addressing future features in their hardware design, the impact of these strategies on the manufacturing of these parts, how safety is rated and reliability targeted and tested. Learn more and register.
- And rounding out the series, on November 14 at 10 am CDT, Brenda Baney, BCubed Consulting, will serve as webinar moderator, guiding expert panelists Yusuf Williams, Harman Automotive Division; Bing Xu, iPoint-systems Gmbh; and Leanne Mallini, Analog Devices, in a discussion on what automakers, startups, and T1s are demanding from their supply chains in terms of sustainability. Panelists will weigh in the top three challenge areas beyond current regulatory reporting and what may be coming next and will touch on recycling, PFAS, carbon neutrality, and the changeover of electronics assembly reporting. Learn more and register.
“These free webinar sessions will allow participants to better understand technology gaps, broaden their professional connections, and uncover strategies for meeting reliability objectives,” said Tracy Riggan, IPC senior director, business development, Solutions. “IPC would like to thank all speakers and moderators for lending their expertise and especially to Indium Corporation for sponsoring the webinar series.”
Share on:
Suggested Items
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
06/17/2025 | Marcy LaRont -- Column: Marcy's MusingsThis month, we’re talking about “the hole truth,” namely, via reliability in an HDI world. As I contemplated what it takes to get the “perfect” via, it got me thinking about what it takes to create the “perfect” magazine issue.
Advint Delivers Advanced Electroplating Training to Triangle Labs
06/02/2025 | Advint IncorporatedDuring the last week of April, Advint Incorporated conducted a comprehensive two-day on-site electroplating training session for the technical team at Triangle Labs, Inc., a key innovator in the printed circuit board space. The training was structured to align with the demands of high-reliability plating processes suitable for RF and high-frequency substrates.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.
Copyright © 2025 I-Connect007 / Global Electronics Association Publishing Group All rights reserved.
Log in