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IPC’s Road to Reliability Webinar Series Covers New e-Mobility Technologies
August 28, 2024 | IPCEstimated reading time: 1 minute
Starting September 12, IPC’s Road to Reliability Webinar series will bring industry leaders together to discuss the hurdles in achieving reliability for new e-mobility technology. Speakers will examine reliability drivers, technology applications, and target lifecycles in each free webinar.
- On September 12, 10 am CDT, Habib Mustain, Hereaus, will discuss power electronic substrate types, requirements, and challenges for today's EV applications and will address essential topics related to the use of power substrates in power electronic applications with an emphasis on EVs. Stan Rak, SF Rak Company, will serve as webinar moderator. Learn more and register.
- On October 17, 10 am CDT, Brian O'Leary, Indium Corporation, will discuss the impact of the software defined vehicle on hardware design and manufacture. In addition, he will cover how automakers and system designers are addressing future features in their hardware design, the impact of these strategies on the manufacturing of these parts, how safety is rated and reliability targeted and tested. Learn more and register.
- And rounding out the series, on November 14 at 10 am CDT, Brenda Baney, BCubed Consulting, will serve as webinar moderator, guiding expert panelists Yusuf Williams, Harman Automotive Division; Bing Xu, iPoint-systems Gmbh; and Leanne Mallini, Analog Devices, in a discussion on what automakers, startups, and T1s are demanding from their supply chains in terms of sustainability. Panelists will weigh in the top three challenge areas beyond current regulatory reporting and what may be coming next and will touch on recycling, PFAS, carbon neutrality, and the changeover of electronics assembly reporting. Learn more and register.
“These free webinar sessions will allow participants to better understand technology gaps, broaden their professional connections, and uncover strategies for meeting reliability objectives,” said Tracy Riggan, IPC senior director, business development, Solutions. “IPC would like to thank all speakers and moderators for lending their expertise and especially to Indium Corporation for sponsoring the webinar series.”
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Simon Khesin - Schmoll MaschinenSuggested Items
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
SEL Showcases Global Factories and Product Development Journey for Manufacturing Day
10/10/2025 | SELSEL is celebrating Manufacturing Day 2025 with the release of a new video showcasing its product development and vertically integrated manufacturing process.
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.