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Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
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It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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IPC’s Road to Reliability Webinar Series Covers New e-Mobility Technologies
August 28, 2024 | IPCEstimated reading time: 1 minute
Starting September 12, IPC’s Road to Reliability Webinar series will bring industry leaders together to discuss the hurdles in achieving reliability for new e-mobility technology. Speakers will examine reliability drivers, technology applications, and target lifecycles in each free webinar.
- On September 12, 10 am CDT, Habib Mustain, Hereaus, will discuss power electronic substrate types, requirements, and challenges for today's EV applications and will address essential topics related to the use of power substrates in power electronic applications with an emphasis on EVs. Stan Rak, SF Rak Company, will serve as webinar moderator. Learn more and register.
- On October 17, 10 am CDT, Brian O'Leary, Indium Corporation, will discuss the impact of the software defined vehicle on hardware design and manufacture. In addition, he will cover how automakers and system designers are addressing future features in their hardware design, the impact of these strategies on the manufacturing of these parts, how safety is rated and reliability targeted and tested. Learn more and register.
- And rounding out the series, on November 14 at 10 am CDT, Brenda Baney, BCubed Consulting, will serve as webinar moderator, guiding expert panelists Yusuf Williams, Harman Automotive Division; Bing Xu, iPoint-systems Gmbh; and Leanne Mallini, Analog Devices, in a discussion on what automakers, startups, and T1s are demanding from their supply chains in terms of sustainability. Panelists will weigh in the top three challenge areas beyond current regulatory reporting and what may be coming next and will touch on recycling, PFAS, carbon neutrality, and the changeover of electronics assembly reporting. Learn more and register.
“These free webinar sessions will allow participants to better understand technology gaps, broaden their professional connections, and uncover strategies for meeting reliability objectives,” said Tracy Riggan, IPC senior director, business development, Solutions. “IPC would like to thank all speakers and moderators for lending their expertise and especially to Indium Corporation for sponsoring the webinar series.”
Suggested Items
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
05/01/2025 | Team NCAB -- Column: Fresh PCB ConceptsAs a field application engineer with many years of experience, I’ve conducted thousands of designs for manufacturing (DFM) analyses on printed circuit boards (PCBs). From basic one-layer boards to complex high density interconnect (HDI) designs, I’ve provided technical advice across a wide spectrum of technologies.
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
Microchip Completes Radiation-Hardened Power MOSFET Family to MIL-PRF-19500/746 and Achieves JANSF 300 Krad Capability
04/22/2025 | MicrochipThe JANS qualification represents the highest level of screening and acceptance requirements, ensuring the superior performance, quality and reliability of discrete semiconductors for aerospace, defense and spaceflight applications.