-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
EpoxySet to Feature State-of-the-ART Engineered UV cured products at The ASSEMBLY Show
August 28, 2024 | epoxySetEstimated reading time: 1 minute
EpoxySet Inc. will be showcasing our extensive line of high-tech, UV/light cure adhesives at booth #1040 at The ASSEMBLY Show, October 22nd-24th, 2024, Rosemount, Illinois.
Our superior UV line includes the Flashbond® UV-3720. This active alignment adhesive has exceptionally low cure shrinkage under 0.1%. It is a one part, dual cure (UV or HEAT) system with a high Tg of 155°C, a low CTE of 30pm/°C and can withstand 85/85 for 1000 hours with very low moisture absorption. It is perfect for holding alignments through a temperature range of -55 to 200°C
Also included in our vast light cure line:
- Flashbond® UV-8403- High moisture resistance for autoclaves and 85/85 environments.
- Flashbond® UV-3607HT – Dual Cure system for use in shadowed areas
- Flashbond® UV-5608DC – Delay cured technology to bond opaque substrates.
- Flashbond® UV-6502CL – Optically clear adhesive/coating that does not yellow
- Flashbond® UV-8701E – Biocompatible adhesive/sealant
EpoxySet has been providing high performance, advanced polymers to medical and electronic device manufacturers since 1997, providing consistent quality products with superior technical support to meet the most demanding applications. Vast experience in creating custom formulations allows unique solutions quickly.
Suggested Items
Global Top 5 SSD Module Makers Continue to Gain Market Share; Chinese Brands Leverage Home Advantage
10/23/2024 | TrendForceTrendForce’s latest investigations reveal that the combined market share of the top five SSD module makers in the retail sector has surged from 59% in 2022 to 72% in 2023, reinforcing a trend of larger companies expanding their dominance.
Alpha and Omega Semiconductor to Exhibit at electronica 2024
10/23/2024 | AOSAlpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced it will exhibit and demonstrate the capabilities of its expanding line of breakthrough application-specific power semiconductor, power IC and module solutions at electronica 2024.
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
10/23/2024 | SEMISEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.
IDC FutureScape: The AI Pivot Towards Becoming an AI-Fueled Business
10/21/2024 | IDCAccording to a recent research from International Data Corporation (IDC) entitled The Global Impact of Arti f icial Intelligence on the Economy and Jobs, AI will have a cumulative global economic impact of $19.9 trillion through 2030 and will drive 3.5% global GDP in 2030.
TRI Launches High-Speed 3D AXI for Semiconductor Applications
10/18/2024 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, proudly announces the release of the high-throughput 3D SEMI CT AXI TR7600 SIII Plus, specifically designed for high-reliability electronics manufacturing, including the Semiconductor and Advanced Packaging industries.