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DuPont/Qnity Innovators in Semiconductor Materials Named 2025 Heroes of Chemistry

06/10/2025 | DuPont
DuPont today announced that 13 of its current and former scientists and engineers have been named 2025 Heroes of Chemistry by the American Chemical Society (ACS) for an innovative program that progressed semiconductor lithography.

Indium to Showcase Innovative Materials Powering AI Technology at Productronica China

03/25/2025 | Indium Corporation
As a proven leader in Metal-Based Thermal Interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio of thermal interface materials (TIMs) that enabling AI advancements at Productronica China, March 26-28, in Shanghai, China.

Connect the Dots: Designing for Reality—Surface Finish

01/29/2025 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we discussed the solder mask and legend process, one of the final steps in the PCB manufacturing process. The board is nearly complete. We just need to wrap up production by applying a surface finish to protect the copper from oxidation and facilitate soldering components onto the board.

Exploring Advanced PCB Final Finishing: DIG, RAIG Technologies

10/24/2024 |  Rich DePoto, Uyemura
In this interview, Rich DePoto of Uyemura provides a deep overview and explanation of Reduction-assisted Immersion Gold (RAIG) and direct immersion gold (DIG) technology, and their applications and benefits when compared to traditional final finishes. He delves into the intricacies of electroless nickel corrosion and “black pad,” exploring its causes, consequences, and the measures that can be taken to mitigate this problem. This comprehensive overview will provide insight toward sound decision-making for those operating in environments where perfect process control is a challenge.

FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024

10/21/2024 | Foxconn
FIT Hon Teng, a subsidiary of Hon Hai Precision Industry, will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit.
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