American Made Advocacy: New Congress, New Opportunities
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
Defense Speak Interpreted: SWaPing Nanosatellites for Defense Systems
Surface Finish: Tune in to the Latest Podcast Episode of On the Line with… ASC Sunstone
September 4, 2024 | I-Connect007Estimated reading time: Less than a minute
Don't miss episode 11 of "On the Line with… ASC Sunstone: Designing for Reality," in which ASC Sunstone’s General Manager, Matt Stevenson, discusses the critical topic of surface finishes in PCB manufacturing.
Continuing our deep dive into the PCB manufacturing process, Matt discusses the various types of surface finishes, including Hot Air Solder Leveling (HASL), Immersion Silver, ENIG (Electroless Nickel Immersion Gold), ENIPIG (Electroless Nickel Immersion Palladium Immersion Gold), and Immersion Tin. Each finish is broken down in terms of its benefits, drawbacks, and ideal applications, offering listeners valuable insights into choosing the right finish for their specific needs.
I-Connect007 is dedicated to delivering high-quality digital content specifically designed for the electronics industry. With a portfolio that includes magazines, books, newsletters, market reports, podcasts, and event coverage, the company consistently provides the insights and information professionals need. As the industry's longest-running digital media company, I-Connect007 continues to set the standard as a leading publisher of original content for the global electronics community.
Visit our educational resource center to access more free content and stay ahead in the ever-evolving electronics industry.
Share on:
Suggested Items
Connect the Dots: Designing for Reality—Surface Finish
01/29/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the solder mask and legend process, one of the final steps in the PCB manufacturing process. The board is nearly complete. We just need to wrap up production by applying a surface finish to protect the copper from oxidation and facilitate soldering components onto the board.
Exploring Advanced PCB Final Finishing: DIG, RAIG Technologies
10/24/2024 | Rich DePoto, UyemuraIn this interview, Rich DePoto of Uyemura provides a deep overview and explanation of Reduction-assisted Immersion Gold (RAIG) and direct immersion gold (DIG) technology, and their applications and benefits when compared to traditional final finishes. He delves into the intricacies of electroless nickel corrosion and “black pad,” exploring its causes, consequences, and the measures that can be taken to mitigate this problem. This comprehensive overview will provide insight toward sound decision-making for those operating in environments where perfect process control is a challenge.
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
10/21/2024 | FoxconnFIT Hon Teng, a subsidiary of Hon Hai Precision Industry, will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit.
Indium Experts to Present Advanced Research at International Symposium on Microelectronics
09/20/2024 | IndiumIndium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts.
Real Time with… IPC APEX EXPO 2024: Exploring the Future of Surface Finishes
04/25/2024 | Real Time with...IPC APEX EXPOJoe McGurran, product marketing director for MKS Atotech, looks into the future of surface finishes, discussing less nickel, reduced thickness, technologies influencing HDI and UHDI, and the benefits of nickel-free surface finishes. He also touches on popular finishes like ENIG and palladium immersion gold and discusses the value proposition of making a change.