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IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

09/16/2024 | IPC
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”

Infineon Pioneers World’s First 300 mm Power Gallium Nitride (GaN) Technology

09/16/2024 | Infineon
Infineon Technologies AG announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology.

Precise PCB Structuring with LPKF ProtoMats and ProtoLasers

09/16/2024 | LPKF
RF circuits have a firm place in technical applications. They require precise geometric layouts to achieve reliable results. LPKF will be showing how these can be manufactured in your own laboratory at booth 325C on the European Microwave Week 2024 from September 24 to 26 in Paris.

Home Energy Management Systems Booming in Europe and North America

09/16/2024 | Berg Insight
Berg Insight, the world’s leading IoT market research provider, today released a new market report covering the Home Energy Management Systems (HEMS) market. In this study, a HEMS is defined as a system that at minimum consists of a solar PV system, battery storage system and a web-based management portal or smartphone app that allows for remote monitoring and control of the system.

Requirements & Systems Portal Application Now Available on the Altium 365 Cloud Platform

09/13/2024 | Altium
Altium, a global leader in electronics design systems, announced today that it has launched the Requirements & Systems Portal Application into the Altium 365 cloud platform for electronics design collaboration.
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