Rethink Robotics Relaunches, Rebrands, and Unveils New Range of Flagship Products at IMTS 2024
August 30, 2024 | PRWEBEstimated reading time: 1 minute
In celebration of its longtime role as an innovator and a partner in enhancing productivity and workplace safety, Rethink Robotics returns to IMTS with a major company relaunch and rebranding. With a fresh identity and renewed vision, Rethink Robotics continues to push the boundaries of innovation, seamlessly integrating advanced robotics into the workplace.
In 2008 Rethink Robotics helped blaze the trail for user-friendly collaborative robots with groundbreaking robots like Baxter and Sawyer, which helped usher in a new era of safe, reliable, and flexible collaboration with robots in the workplace. The new robots that will be unveiled at IMTS have been significantly upgraded with improved design, as well as more reliable and robust hardware, resulting in increased precision, speed, and reliability, making them far more capable for industrial applications.
In addition to an autonomous mobile robot (AMR) and mobile manipulator (MMR) platform, Rethink Robotics will unveil a family of collaborative robots (cobots) designed to reliably handle a range of payloads from 6 to 30 kg. All these products are designed to be better, faster, and stronger than was previously possible across every technical performance indicator.
Rethink Robotics is dedicated to continuous improvement, with a strong focus on customer satisfaction. Its user-centric products and smooth implementation processes ensure that businesses of all types can fully leverage advanced technology.
Please join us to celebrate the rebirth of Rethink Robotics at IMTS 2024 (North Building, Level 3, Booth 236203) and for a press conference at 11 a.m. CT, September 9, 2024.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.