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Advanced Electronics Packaging Digest

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Suggested Items

Imec Achieves Breakthroughs in Ferroelectric Memory for AI-Era Needs

06/22/2026 | Imec
At the 2026 IEEE / JSAP symposium on VLSI Technology & Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents two advances in ferroelectric memory research, targeting both ferroelectric capacitors and ferroelectric field-effect transistors as emerging candidates to enable low-voltage operation and high-density integration.

Intel Names New Leader at Intel Foundry to Accelerate Manufacturing

06/22/2026 | Intel
Intel Corporation announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan.

Altus Group Expands Soldering Portfolio with SEHO Partnership

06/22/2026 | Altus Group
Altus Group, a leading distributor of capital equipment for electronics manufacturing in the UK and Ireland, has announced a new partnership with SEHO Systems GmbH, a German manufacturer specialising in wave and selective soldering systems, automation technology as well as THT inspection solutions.

PCB Technologies Secures Approximately EUR 8.6M Orders from Semiconductor Client

06/19/2026 | PRNewswire
PCB Technologies, a global leader in advanced electronic and PCB manufacturing solutions, is pleased to report that during the past two weeks, until June 12, 2026, several orders have been placed with the company's PCB and Substrates Division by a leading customer in the European semiconductor equipment industry.

Fujitsu, IBM Japan Partner to Accelerate Enterprise System Modernization

06/19/2026 | JCN Newswire
Fujitsu Limited and IBM Japan, Ltd. announced that they will accelerate their collaboration in the field of business system modernization in order to advance enterprise digital transformation and address challenges associated with legacy systems.
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