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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Neways Appoints Gerben Edelijn as Member of its Supervisory Board

09/25/2026 | Neways
Neways Electronics International N.V. announces the appointment of Mr Gerben Edelijn as a member of its Supervisory Board effective 22 September 2026.

Dymax to Showcase PCB Protection and Thermal-Stress Solutions at SMTA Guadalajara

09/25/2026 | Dymax
Dymax, a global manufacturer of light-curing adhesives and equipment, will exhibit at SMTA Guadalajara, October 7-8, booth 830, where visitors can discover light-curing solutions designed to help manufacturers improve efficiency, reliability, and process performance.

Cadence, TSMC Collaborate on Certified Tools and Silicon-Proven UALink IP

09/25/2026 | Cadence Design Systems
Cadence announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers.

ESGS 2026 to Drive Innovation Across the Electronic Gases Ecosystem

09/25/2026 | SEMI
The Electronic Specialty Gases & Systems Conference (ESGS) 2026 will bring together leaders across the electronic gases value chain November 10-12, 2026, at the Hyatt Regency Phoenix in Arizona.

Teledyne Energy Systems Selected by NASA for Collaboration to Advance Lunar Power Technology

09/25/2026 | BUSINESS WIRE
Teledyne Energy Systems, Inc., a subsidiary of Teledyne Technologies Incorporated, has been selected to participate in NASA’s Announcement of Collaboration Opportunity, establishing a collaborative effort with NASA’s Glenn Research Center and Johnson Space Center to advance next-generation space power technology.
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