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September 3, 2024 | AtotechEstimated reading time: 3 minutes
MKS’ Atotech will participate in this year’s KPCA Show 2024 in Incheon, held at Songdo Convensia from September 4-6, 2024.
MKS will highlight its core brands, Atotech® and ESI®, and present the latest advances in PCB and packaging substrate manufacturing. Covering chemical processes, production systems, auxiliary equipment, lasers, and software solutions, attendees will be able to explore a wide range of products and innovations. These offerings are designed to improve production yield, reliability and efficiency to deliver superior results for manufacturers.
Leveraging its expertise in lasers, optics, motion, process chemistry, and equipment, MKS stands out for its ability to Optimize the InterconnectSM, a key driver for the coming era of advanced electronics characterized by increasing miniaturization and complexity. The Optimize the Interconnect philosophy underscores the company’s distinctive ability to foster the development of cutting-edge solutions in advanced PCB and packaging substrate manufacturing for its customers and employees. We are deeply committed to enabling new technologies and finer feature dimensions through the integration of MKS’ ESI laser drilling technologies with MKS’ Atotech chemistry and plating equipment.
Gucheol Kim, Marketing Manager of Atotech Korea, said, “As technology advances, printed circuit boards, packaging substrates, and semiconductors continue to play a key role in driving innovation in various industries. These components are essential for powering 5G networks, enabling high-performance computing, and supporting sustainable transportation solutions such as electric vehicles (EVs) and hydrogen cars. These technologies are the foundation for a more connected and sustainable future. We are committed to meeting the evolving needs of our customers by delivering cutting-edge solutions that push the boundaries of electronics design.”
On September 4, Mr. Yousic Hong, Business Manager Korea, will present “Package Substrate Technology Trends and Customer Requirements” at the KPCAshow 2024 Subsidiary Event – Exhibitors’ Seminar. All visitors are encouraged to join this key presentation and stop by booth H201 to discover MKS’ Atotech’s latest products and services.
This year’s Chemical process highlights include:
Printoganth® MV TP2: Optimized for fine line and high-frequency applications, providing low electroless copper thickness with excellent coverage, improved dry film adhesion, reduced dummy plating, and cost-effective process performance.
Printoganth® MV TP3: Advanced electroless copper bath designed to provide a uniform 100-150 nm copper deposit on IC substrates with excellent adhesion to low roughness dielectrics and reliable bottom-up recrystallization.
Printoganth® P2: The latest addition to the Printoganth® P Series, this horizontal electroless copper bath offers exceptional throwing power, adhesion, reliability, and multi-electrolyte compatibility, making it ideal for IC substrate, HDI, and flex PCB manufacturers.
Securiganth® MV Cleaner GFR-S1: Fluoride-free solution designed to efficiently remove glass filler and clean the surface of advanced dielectric materials, improve electroless copper adhesion, and provide blister-free deposition on smooth surfaces such as solder resists and LCP materials.
InPro® Pulse TVF: Thermal management for 5G and LED applications is improved with the new process. Benefits include high reliability, low-cost inclusion-free core filling, and increased productivity with reduced plating time and maintenance costs.
Cuprapulse® XP8: The upgrade to the vertical pulse copper plating process for soluble anodes surpasses DC technology in throwing power. Superior productivity and quality are achieved with precise surface distribution, improved tensile strength, and effective wetting. This process is ideal for HDI, MLB, and automotive PCB applications.
EcoFlash® S 300: Iron sulfate-based differential etchant that increases yield and lowers cost by preventing undercuts, maintaining circuit integrity, and reducing roughness while allowing easy iron regeneration with hydrogen peroxide.
Stannatech® IC: Immersion tin solution for package substrates, providing reduced solder mask attack and copper dissolution, superior foaming control with optimized metal ion exchange and contamination management.
This year’s Equipment highlights include:
- G-Plate®: Vertical desmear and electroless HVM plating tool for next-generation high-end package substrates with well-organized particle control.
- Geode™ G2 PCB laser drill: Next-generation CO2 via drilling for HDI and integrated circuit packaging manufacturing.
- CapStone™ Flex PCB laser drill: Breakthrough productivity – Increase throughput up to 2x and reduce overall processing costs by 30%.
Conference: KPCA Show 2024
Date: September 4-6, 2024
Booth: H201
Venue: Incheon Songdo Convensia
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