Flexible Thinking Flexible Circuit Technology—Looking Back and Forward
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2025
September 4, 2024 | IPCEstimated reading time: 1 minute
WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 6-8, 2025 at Baird Center in Milwaukee, Wis. The deadline for proposals is on November 8, 2024.
Expert technical conference presentations and professional development courses are being sought in the following topic areas:
- Case Studies on A-620 Success
- Quality Requirements
- ESD Impacts on Harness
- ESD Transmission through Harnesses
- Hi Frequency Cabling
- X-ray Inspection Techniques
- Crimping Challenges/Dos and Don’ts
- Crimp Cross Sectioning
- Wire Harness Troubleshooting
- Reliability Issues and Failure Analysis
- Wiring Harness Education and Training
- Coil Winding
- Connector Advances
- Tooling
- Process Equipment/Productions
- Calibration
- Ultrasonics Splicing and Terminating
- Harness Design Drawings
- Engineering
- Overmolding
- Testing – Electrical/Environmental/
- Mechanical
- Electric Vehicles (EV)/Electric Mobility
- Cleanliness and FOD
- Wiring Harness Rework
Proposals must include an approximate 300-word abstract/summary of the presentation and description of what the audience will learn, and who will benefit from attending the presentation. Technical conference paper abstracts and course proposals are due November 8, 2024. For more information or to submit a proposal, visit https://app.oxfordabstracts.com/stages/75906/submitter. For questions regarding the technical conference at EWPTE, contact Julia Flynn, IPC/WHMA conference and events manager, at JuliaFlynn@ipc.org.
For additional information on attending or exhibiting, visit www.electricalwireshow.com, or contact Alicia Balonek, IPC/WHMA senior director of trade shows and events at AliciaBalonek@ipc.org.
Share on:
Suggested Items
TPCA Thailand PCB Talent Matchmaking Conference Successfully Connects Industry and Academia
03/10/2025 | TPCAThe Taiwan Printed Circuit Association (TPCA) recently concluded its "International PCB Talent Matchmaking Conference" in Bangkok, Thailand, on March 5, 2025.
SEMICON China 2025 to Highlight Key Opportunities and Challenges in Advancing Semiconductor Industry Growth
03/07/2025 | SEMISEMICON China 2025 will gather industry visionaries and leaders from March 26-28 at the Shanghai New International Expo Centre to delve into the latest developments, trends, and innovations in key areas crucial for propelling industry growth to $1 trillion by 2030.
2025 IEEE Electronic Components and Technology Conference
03/04/2025 | IEEEMore than 2,000 scientists, engineers and businesspeople are expected to attend the 75th annual IEEE Electronic Components and Technology Conference (ECTC) from May 27-30, 2025 at the Gaylord Texan Resort & Convention Center here.
Best Technical Papers at IPC APEX EXPO 2025 Selected
03/03/2025 | IPCThe best technical conference papers of IPC APEX EXPO 2025 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Conference Program Committee (TPC), the international group of paper authors will be recognized during show opening remarks on Tuesday, March 18.
First Pan-European Electronics Design Conference (PEDC) in Vienna Inspires Participants from 20 Countries
02/06/2025 | IPCThe first Pan-European Electronics Design Conference (PEDC) in Vienna was a great success The new international conference, organized by Fachverband Elektronikdesign und -fertigung e. V. (FED) and IPC, brought together experts and industry representatives from 20 countries and four continents.