Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging

02/11/2026 | I-Connect007 Editorial Team
I-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.

PEDC: Built for the Design Community by the Design Community

02/05/2026 | Peter Tranitz, Global Electronics Association
The Pan-European Electronics Design Conference (PEDC) was developed to provide Europe’s electronics design community with a non-commercial, Pan-European, technologically advanced forum. PEDC 2026 delivered exactly that. This second edition of the conference brought together 130 participants from 23 countries across Europe and beyond for two days of technical exchange, discussion, and connection. Hosted by the Global Electronics Association and Fachverband Elektroniksdesign und-fertigung e.V. (F.E.D)., and supported by Altium, Siemens, and Zuken, the event featured three technical tracks, 36 presentations, three keynotes, and a group of exhibitors.

Latest SMT007 Magazine Previews APEX EXPO 2026: Bigger and Better Than Ever

02/04/2026 | I-Connect007 Editorial Team
APEX EXPO 2026 is coming soon, and it is bigger and better than ever. In the February issue of SMT007 Magazine, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year. Consider this your passport to where the electronics manufacturing industry is headed in 2026.

Nolan’s Notes: Five Key Changes to APEX EXPO

02/05/2026 | Nolan Johnson -- Column: Nolan's Notes
This month, we devote our issue of SMT007 Magazine to previewing the upcoming APEX EXPO, March 16–20, in Anaheim, California. APEX EXPO stays in Anaheim until 2029, so, geographically, things are stable, but topically, changes are afoot. Here are five ways the trade show is changing for the better this year.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/30/2026 | Marcy LaRont, I-Connect007
It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in