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DELO Introduces UV-approach for Fan-out Wafer-level Packaging

10/25/2024 | DELO
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.

DELO: New Semicon Adhesive Propels Autonomous Driving Forward

10/20/2023 | DELO
DELO has developed a flexible electronics adhesive that permanently seals sensor housings airtight and thus reliably protects components such as image sensors.

Siemens & Deloitte Demonstrate Industry 4.0 innovation at The Smart Factory @ Wichita

01/19/2023 | Siemens Digital Industries Software
Siemens Digital Industries Software announced the opening of eXplore Live at The Smart Factory @ Wichita, an experience center convened by Deloitte that marries an ecosystem of world-leading organizations with business strategy and cutting-edge technology to demonstrate Industry 4.0.

Peters: LED Curing Perfected Thanks to DELO

11/19/2021 | Peters
The cooperation with the equipment and material manufacturer DELO has proven successful and is renewed for another year. DELO provides Peters with a system for UV LED curing consisting of the DELOLUX 202 lamp head and the DELOLUX pilot.

DELO Launches Liquid Pressure-sensitive Adhesives

11/05/2020 | Delo Industrial Adhesives
DELO has developed adhesives that have similar properties to (double-sided) adhesive tapes but are applied in liquid form. This helps users save time and costs in the production process.
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