SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 1
Standard of Excellence: Training Your Team to Excel in Customer Service
Smart Automation: What Industry 4.0 Means for Mid-sized Electronics Manufacturing
Indium Experts to Speak on Sustainable e-Mobility and PCB Supply Solutions at Productronica India
September 9, 2024 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi, India.
The presentation, titled Sustainable and Reliable Solder Materials for an Industry Centered Around Sustainability – How to Reduce e-Mobility Circuit Board Assembly Carbon Emissions While Improving Solder Joint Reliability, will focus on innovative, sustainable solutions for the e-Mobility sector.
Nash's presentation will address the growing demand for environmentally friendly manufacturing processes in the automotive industry. He will discuss how advanced solder materials can simultaneously reduce carbon emissions and enhance the reliability of circuit board assemblies in electric vehicles.
“As the e-Mobility sector continues to grow, it's crucial that we develop solutions that not only meet performance requirements but also contribute to sustainability goals,” said Nash. “Our latest innovations in solder materials demonstrate that improved reliability and reduced environmental impact can go hand in hand.”
Indium Corporation Associate Director for Global Technical Services & Application Engineering, Jonas Sjoberg, will also join a panel discussion on September 12. The panel, titled PCB Value Chain, The Missing Links, is part of the India PCB Tech Conference. The conference is organized by ELCINA and Messe Muenchen India, with support from IPCA (Indian Printed Circuit Association). This event brings together companies from across the PCB industry and its supply chain.
About the Speakers
Chris Nash is the Senior Sales and Business Development Manager for Indium Corporation’s PCB Assembly Solder Paste. With an intimate understanding of customer needs and challenges, he works closely with the company’s R&D team to deliver fully scaled, launched, marketable product solutions for the PCB assembly market. Chris also provides comprehensive technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is responsible for ensuring the product line is poised for future growth to best meet the needs of existing and potential customers.
Jonas Sjoberg is Associate Director for Global Technical Service & Application Engineering for Indium Corporation. He is based in Kuala Lumpur, Malaysia, where he provides technical support to key regional and global customers.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.