-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueMoving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Indium Experts to Speak on Sustainable e-Mobility and PCB Supply Solutions at Productronica India
September 9, 2024 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi, India.
The presentation, titled Sustainable and Reliable Solder Materials for an Industry Centered Around Sustainability – How to Reduce e-Mobility Circuit Board Assembly Carbon Emissions While Improving Solder Joint Reliability, will focus on innovative, sustainable solutions for the e-Mobility sector.
Nash's presentation will address the growing demand for environmentally friendly manufacturing processes in the automotive industry. He will discuss how advanced solder materials can simultaneously reduce carbon emissions and enhance the reliability of circuit board assemblies in electric vehicles.
“As the e-Mobility sector continues to grow, it's crucial that we develop solutions that not only meet performance requirements but also contribute to sustainability goals,” said Nash. “Our latest innovations in solder materials demonstrate that improved reliability and reduced environmental impact can go hand in hand.”
Indium Corporation Associate Director for Global Technical Services & Application Engineering, Jonas Sjoberg, will also join a panel discussion on September 12. The panel, titled PCB Value Chain, The Missing Links, is part of the India PCB Tech Conference. The conference is organized by ELCINA and Messe Muenchen India, with support from IPCA (Indian Printed Circuit Association). This event brings together companies from across the PCB industry and its supply chain.
About the Speakers
Chris Nash is the Senior Sales and Business Development Manager for Indium Corporation’s PCB Assembly Solder Paste. With an intimate understanding of customer needs and challenges, he works closely with the company’s R&D team to deliver fully scaled, launched, marketable product solutions for the PCB assembly market. Chris also provides comprehensive technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is responsible for ensuring the product line is poised for future growth to best meet the needs of existing and potential customers.
Jonas Sjoberg is Associate Director for Global Technical Service & Application Engineering for Indium Corporation. He is based in Kuala Lumpur, Malaysia, where he provides technical support to key regional and global customers.
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.