- 
                                
                        
                         - News
 -  Books
                        
Featured Books
- smt007 Magazine
 Latest Issues
Current Issue
                                                                                                        Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
                                                                                                        Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
                                                                                                        Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
 Article Highlights
- Columns
 - Links
 - Media kit
 ||| MENU - smt007 Magazine
 
Indium Experts to Speak on Sustainable e-Mobility and PCB Supply Solutions at Productronica India
September 9, 2024 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi, India.
The presentation, titled Sustainable and Reliable Solder Materials for an Industry Centered Around Sustainability – How to Reduce e-Mobility Circuit Board Assembly Carbon Emissions While Improving Solder Joint Reliability, will focus on innovative, sustainable solutions for the e-Mobility sector.
Nash's presentation will address the growing demand for environmentally friendly manufacturing processes in the automotive industry. He will discuss how advanced solder materials can simultaneously reduce carbon emissions and enhance the reliability of circuit board assemblies in electric vehicles.
“As the e-Mobility sector continues to grow, it's crucial that we develop solutions that not only meet performance requirements but also contribute to sustainability goals,” said Nash. “Our latest innovations in solder materials demonstrate that improved reliability and reduced environmental impact can go hand in hand.”
Indium Corporation Associate Director for Global Technical Services & Application Engineering, Jonas Sjoberg, will also join a panel discussion on September 12. The panel, titled PCB Value Chain, The Missing Links, is part of the India PCB Tech Conference. The conference is organized by ELCINA and Messe Muenchen India, with support from IPCA (Indian Printed Circuit Association). This event brings together companies from across the PCB industry and its supply chain.
About the Speakers
Chris Nash is the Senior Sales and Business Development Manager for Indium Corporation’s PCB Assembly Solder Paste. With an intimate understanding of customer needs and challenges, he works closely with the company’s R&D team to deliver fully scaled, launched, marketable product solutions for the PCB assembly market. Chris also provides comprehensive technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is responsible for ensuring the product line is poised for future growth to best meet the needs of existing and potential customers.
Jonas Sjoberg is Associate Director for Global Technical Service & Application Engineering for Indium Corporation. He is based in Kuala Lumpur, Malaysia, where he provides technical support to key regional and global customers.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.