Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Teledyne Completes Acquisition of Select Aerospace and Defense Electronics Businesses of Excelitas

02/05/2025 | BUSINESS WIRE
Teledyne Technologies Incorporated announced today the successful completion of the acquisition of select aerospace and defense electronics businesses from Excelitas Technologies Corp. (“Excelitas”) for approximately $710 million. The acquisition includes the optical systems business known under the Qioptiq® brand based in Northern Wales, UK, as well as the U.S.-based advanced electronic systems business.

Flexible Thinking: Mind-tapping into January

02/05/2025 | Joe Fjelstad -- Column: Flexible Thinking
It’s January again, and our beleaguered planet has completed yet another trip around the sun. The Romans named January in honor of their god Janus, who is usually depicted as a bearded old man with two faces—one looking back to the past and the other looking forward to the future. People venerated Janus as the god of beginnings and endings, transitions, and the passage of time. With that in mind, I’ll look 10 years into the future—hopefully with a bit of inspiration from Janus—and prognosticate what might be happening in electronic design.

INEMI Launches Webinar on Ecological Footprint Minimization for Sustainable Electronics Roadmap

02/05/2025 | iNEMI
Join us for an insightful webinar as INEMI kicks off the development of additional content for the Sustainable Electronics Roadmap, focusing on ecological footprint minimization.

Jabil Recognizes Nordson Electronics Solutions with the 2024 Best Strategic Supplier Award

02/05/2025 | Nordson Corporation
Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, has been honored with the 2024 Jabil Best Strategic Supplier Award, underscoring Nordson’s essential role in enabling Jabil, a global leader in manufacturing services, to achieve operational excellence and deliver exceptional value across its supply chain.

YINCAE Launches UF 120LA

02/04/2025 | YINCAE
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in