-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Scrutinizing Solder Printing
September 10, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.
Nolan Johnson: Adam, what are some threshold moments when you go to solder jetting over solder printing?
Adam Murling: It’s a tandem approach, not all-or-nothing. Let’s say you have a four- or five-mils- (100 to 123 micron) thick stencil, but you also have really fine-pitch BGAs on the same device. There's an argument to be made for not cutting those apertures out because the area ratio will be too challenging.
But then you have a jet or dispenser down the line that can take care of those finer particles, and you want to make sure that the flux chemistry is compatible with the paste you're using in a jet as well as the solder paste on the screen printer; they need to be compatible.
But what happens when things are too large? You have most smaller devices—the 01005s, the 0201s and 0.3-millimeter pitch BGAs, etc.—but you also have connectors that require more solder volume than a 3-mil (75 micron) stencil can provide. You can always use a step stencil—it's been a practice for a long time—but at the same time it causes some process challenges.
If you had both pieces of equipment (stencil printing and jetting) you could then do additive manufacturing and essentially jet the paste on top of your 3-mil (75 micron) height, which was deposited through the stencil, to get more solder volume before placing the connector in place.
Johnson: If you factor in additive manufacturing thinking to solder paste application to get a certain height, does that become a designer concern as much as an assembly concern?
Murling: Nolan, everything's going super small. You're having these automotive manufacturers that are getting into the space and they're not able to find those larger parts that they're comfortable working with anymore. Everyone's focusing more on the smaller devices. They're more readily available with the same power output, but they still need those connectors. You will need a step stencil or you could do the additive approach.
To read this entire conversation, which appeared in the September 2024 issue of SMT007 Magazine, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
KOKI to Showcase Analytical Services and New HF1200 Solder Paste at SMTA Guadalajara 2025
07/31/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, will exhibit at the SMTA Guadalajara Expo & Tech Forum, taking place September 17 & 18, 2025 at Expo Guadalajara, Salón Jalisco Halls D & E in Guadalajara, Mexico.
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.