-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
MEMS & Imaging Sensors Summit to Highlight Innovations Driving the Next Generation of Connectivity
September 11, 2024 | SEMIEstimated reading time: Less than a minute
The SEMI MEMS & Imaging Sensors Summit, themed Sensor Revolution for a Connected Future, is set to bring together some of the world’s leading minds in sensor technology on November 14 at the International Conference Center Munich (ICM), Germany. Registration is open.
Hosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community, the summit will showcase leading-edge innovations in wearable health monitoring, 300mm MEMS manufacturing for increased scalability, and energy-efficient AI for visual applications. Presentations will also explore advancements in hyperspectral imaging, light detection and ranging (LiDAR) for autonomous vehicles, and sustainable sensor technologies driving progress in healthcare, smart mobility, and sustainability.
"As the MEMS and imaging sensors landscape continues to evolve, we’re witnessing rapid advancements in technologies like AI and machine learning, opening doors to innovative applications that are transforming industries,” said Laith Altimime, president of SEMI Europe. “We are excited to bring together industry leaders at this year’s summit to explore how these cutting-edge technologies are coming together to enable sustainable growth and shape a connected future.”
Suggested Items
Mycronic Receives $6-8 Million SLX Mask Writer Order
12/26/2024 | MycronicMycronic AB has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of $6 to $8 million. Delivery of the system is planned for the first quarter of 2026.
SIA Statement on Biden Administration’s Launch of Section 301 Trade Investigation Related to China’s Targeting of the Semiconductor Industry for Dominance
12/25/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding the Biden administration’s decision to launch a Section 301 trade investigation focused on China’s acts, policies, and practices related to targeting of the semiconductor industry for dominance.
Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips
12/23/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production
12/23/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
SIA Praises Finalization of CHIPS Incentives to Supplement SK Hynix’s $3.87 Billion Investment in Indiana
12/20/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and SK hynix. The incentives will supplement the company’s $3.87 billion investment in Indiana for advanced packaging operations and R&D.