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SIA Applauds Finalization of CHIPS Investments for Intel Manufacturing Projects

11/29/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer praising finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and Intel Corporation.

Biden-Harris Administration: CHIPS Incentives Awards with BAE Systems and Rocket Lab

11/27/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Biden-Harris Administration: CHIPS Incentives Award with Intel to Advance U.S. Leading-Edge Chip Capacity

11/27/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Intel Corporation up to $7.865 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award follows the previously signed preliminary memorandum of terms, announced on March 20, 2024, and the completion of the Department’s due diligence.

Hon Hai Research Institute, Yangming Jiaotong University Jointly Won the Future Technology Award

11/26/2024 | Hon Hai Technology Group
Hon Hai Research Institute (HHRI), a subsidiary of Hon Hai Technology Group, the world’s largest technology manufacturing and service provider, joins hands with National Yang -Ming Chiao Tung University ( NYCU ) to break through space Computing Extreme stood out at the " 2024 Taiwan Innovation Technology Expo" and won the "Future Technology Award" for its innovative technology of "application of all-gallium arsenide super interface holography in structured light and stereoscopic vision".

Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab

11/25/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The Department awarded BAE Systems Electronic Systems, a business unit of BAE Systems, Inc., up to $35.5 million in direct funding, and awarded Rocket Lab, the parent company of space power provider SolAero Technologies Corp., up to $23.9 million in direct funding. The Department will disburse the funds based on the companies’ completion of project milestones.
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