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CIL Installs Third Volume Auto SMT Line with In-Line 3D AOI at BP2 Facility

11/25/2024 | CIL
In early November 2024, CIL completed the installation of its third volume SMT PCBA assembly line at its BP2 Semiconductor Packaging facility

RTX's Pratt & Whitney and WZL2 Sign Letter of Intent for F100 Sustainment Work in Poland

11/21/2024 | RTX
Pratt & Whitney, an RTX business, signed a letter of intent with Wojskowe Zaklady Lotnicze Nr. 2 S.A., also known as WZL2, to explore expanded maintenance repair and overhaul capabilities for increased Polish Air Force needs.

Flexible Circuit Technologies Announces Major Expansion of Capabilities & Resources

11/13/2024 | CNW
Flexible Circuit Technologies (FCT), a global design and value add manufacturer of flexible circuits, heaters, and membrane switches based in Minneapolis, MN, announces the opening of FCT-Huizhou.

SIA Applauds CHIPS Act Incentives for Corning and Powerex

11/11/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce for Corning and Powerex.

TTM’s Grand Opening in Malaysia

11/07/2024 | Marcy LaRont, I-Connect007
When I last spoke with Tom Edman, president and CEO of TTM Technologies (TTM), he provided an update about the company’s new high-tech printed circuit board facility under construction in Syracuse, New York, and how the grand opening of a facility in Malaysia is informing TTM’s overall expansion efforts: a cutting-edge facility spread across 27 acres and providing roughly 1,000 jobs. Now, Tom provides more details about the new automated facility, its regional and global impact, and the importance of having both government and industry support.
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