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Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported June 2026 revenue of NT$17,033 million, up 32.83% YoY and 5.14% MoM, again setting a record high for the same period in the company's history.

NCAB Posts Strongest EcoVadis Score Yet in 2026

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NCAB announced its highest EcoVadis result to date, earning an overall score of 79 out of 100, up from 73 in its previous assessment.

The Marketing Minute: The Tyranny of the Dashboard

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Vision Marine Technologies Files U.S. Patent Application for Dual-Mode Electric Outboard Trim Control

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Every Layer Interconnect: The Promise, the Pain, and the Practical Limits

07/02/2026 | Anaya Vardya, American Standard Circuits
Every layer interconnect (ELIC) is an architectural statement about how a PCB is built, signaling a fundamental shift in how we think about routing density, vertical interconnect, and the relationship between design and fabrication. To understand what ELIC solves, you have to understand what it replaces. Traditional HDI construction uses a rigid core with sequential build-up layers on one or both sides:configurations such as 2-4-2 or 3-2-3.
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