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New Senate Bill Supports Reshoring and Restoring U.S. Printed Circuit Board Manufacturing

05/21/2026 | PCBAA
The Printed Circuit Board Association of America celebrates the introduction of a crucial bill that will pave the way to reshore and restore America’s printed circuit board (PCB) industry. Over the past 30 years U.S. share of the world supply of PCBs shrunk from 30 percent to 4 percent because of offshoring. Congress is offering legislative solutions to reverse this trend.

PCB Market Size to Exceed $136.02 Billion by 2035

05/20/2026 | Globe Newswire
According to the SNS Insider, the printed circuit board market size was valued at USD 83.61 billion in 2025 and is expected to reach USD 136.02 billion by 2035, growing at a CAGR of 4.99% during 2026-2035.

Fresh PCB Concepts: Repair and Risk in Electrical Test Failures in PCB Manufacturing

05/21/2026 | Team NCAB -- Column: Fresh PCB Concepts
Electrical test failures represent one of the most critical decision points in PCB manufacturing because they directly expose defects that affect circuit functionality. Unlike cosmetic anomalies or minor process deviations, these failures indicate that the conductive network defined in the design has not been successfully realized in the finished product. Whether identified through continuity testing, isolation testing, or netlist verification, a failed electrical test confirms that the board cannot perform as intended. At this stage, the question is no longer simply whether a defect exists, but whether it can (or should be) repaired.

Rethinking Stackup, Materials, and Tolerances in Modern Designs

05/18/2026 | Kristin Moyer, Global Electronics Association
The simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.

Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components

05/13/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces. 
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