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Explore Advanced Coating Solutions for Electronics at SMTA International 2024

10/03/2024 | ECT
Engineers and electronics professionals attending SMTA International 2024 are invited to visit booth 2713, where Electronic Coating Technologies (ECT) will present solutions for protecting and enhancing the durability of electronic assemblies. In collaboration with Dymax.

Stringent High-speed Requirements Pose Technology Challenges

10/03/2024 | Tarja Rapala and Joe Beers, iNEMI
The ever-increasing demands on printed circuit boards to satisfy the needs of tomorrow’s products means that PCB manufacturers must continuously evolve and react to a wide variety of technological and market requirements such as: Functional density: Finer features, higher density, and increased layers; signal integrity: Higher frequencies, driven by higher data transfer speeds and increased data needs; material properties refinement: Must meet performance as well as environmental demands; Smart manufacturing: Automation, robotics, artificial intelligence, augmented and virtual reality, and machine learning are all part of the future PCB manufacturing floor; and time-to-market: Increased urgency to facilitate new design implementation, product introduction and qualification, quicker market differentiation, and survival.

Dana on Data: Resurrecting IPC Class 1

10/01/2024 | Dana Korf -- Column: Dana on Data
IPC specifications and guidelines have been the standard performance, quality, acceptance, and design basis for PCB designs for approximately two generations. They have proven to be conservative enough that PCBs far exceed their expected lifetimes in a multitude of environments. Requirements are continually adjusted to reflect improvements in materials and process capability that match the increasing component, interconnect, and cost reduction demands.

Efforts Underway to Deliver More Energy-efficient Fiber Networks

09/25/2024 | BUSINESS WIRE
Fiber service providers have been given a boost in their pursuit of more energy-efficient networks that can unlock significant power savings thanks to a new project launched by Broadband Forum.

AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Penang Expo & Tech Forum

08/30/2024 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Penang Expo & Tech Forum taking place September 25-26 at AC Hotel Penang in Malaysia.
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