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Ensuring Compliance with the U.S. CHIPS Act: Identifying the Source of Electronic Components

01/13/2025 | Dr. Eyal Weiss, Cybord
The U.S. CHIPS Act aims to strengthen domestic semiconductor manufacturing and enhance supply chain security. As part of this initiative, manufacturers must ensure compliance with specific regulations regarding the sourcing of electronic components. This white paper provides an overview of the compliance requirements, relevant laws and standards, and introduces innovative technological solutions to verify the provenance of electronic components.

If You Can Define It Right, You Can Design It Right

12/05/2024 | Andy Shaughnessy, Design007
Design engineer Chris Young is known for his optimized design process. As lead hardware engineer with Moog Space and Defense Group and owner of Young Engineering Services, Chris collects data like it’s going out of style, and he leaves nothing to chance. With that in mind, I asked Chris to discuss his views on rules of thumb—which ones work, which ones should be avoided, and how rules fit ideally into the PCB design process.

Alpha and Omega Semiconductor to Exhibit at electronica 2024

10/23/2024 | AOS
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced it will exhibit and demonstrate the capabilities of its expanding line of breakthrough application-specific power semiconductor, power IC and module solutions at electronica 2024.

Explore Advanced Coating Solutions for Electronics at SMTA International 2024

10/03/2024 | ECT
Engineers and electronics professionals attending SMTA International 2024 are invited to visit booth 2713, where Electronic Coating Technologies (ECT) will present solutions for protecting and enhancing the durability of electronic assemblies. In collaboration with Dymax.

Stringent High-speed Requirements Pose Technology Challenges

10/03/2024 | Tarja Rapala and Joe Beers, iNEMI
The ever-increasing demands on printed circuit boards to satisfy the needs of tomorrow’s products means that PCB manufacturers must continuously evolve and react to a wide variety of technological and market requirements such as: Functional density: Finer features, higher density, and increased layers; signal integrity: Higher frequencies, driven by higher data transfer speeds and increased data needs; material properties refinement: Must meet performance as well as environmental demands; Smart manufacturing: Automation, robotics, artificial intelligence, augmented and virtual reality, and machine learning are all part of the future PCB manufacturing floor; and time-to-market: Increased urgency to facilitate new design implementation, product introduction and qualification, quicker market differentiation, and survival.
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