Requirements & Systems Portal Application Now Available on the Altium 365 Cloud Platform
September 13, 2024 | AltiumEstimated reading time: 1 minute
Altium, a global leader in electronics design systems, announced today that it has launched the Requirements & Systems Portal Application into the Altium 365 cloud platform for electronics design collaboration. The Requirements & Systems Portal helps to ensure visibility and awareness of functional requirements from concept to manufacturing, improving upon cost, quality, and risk in the product development process.
The launch follows Altium’s acquisition of Valispace earlier this year. Valispace is a game-changing Systems and Requirements Engineering tool that joins system design and requirements engineering with an AI-assisted and data-driven approach.
The electronics design process is disconnected and plagued by rework because the work of PCB design engineers is often disconnected from system requirements. The Requirements & Systems Portal ensures that electrical teams can write, manage, and verify their requirements directly in the Altium 365 ecosystem, allowing team members from different disciplines to view requirements in the context of their designs. When electrical engineers, electrical managers, systems architects and external stakeholders all have access to the same information, everyone on the team knows they are working with the latest values and up-to-date specifications.
The integration of the Requirements & Systems Portal into Altium 365 extends the platform’s capability as an end-to-end development platform and supports Altium’s goal of connecting everyone involved in the electronics development process.
“The Requirements & System Portal on Altium 365 supercharges innovation and accelerates time to market,” said Ananth Avva, VP and GM of Cloud Platform, Digital Industries, at Altium. “By bringing product-level context to the entire electronics design process, engineers can effortlessly ensure requirements are met across applications like supply chain and simulation. This puts systems thinking at the forefront, empowering engineers to thrive in today’s competitive landscape and deliver world-class electronic products.”
Suggested Items
Explore Advanced Coating Solutions for Electronics at SMTA International 2024
10/03/2024 | ECTEngineers and electronics professionals attending SMTA International 2024 are invited to visit booth 2713, where Electronic Coating Technologies (ECT) will present solutions for protecting and enhancing the durability of electronic assemblies. In collaboration with Dymax.
Stringent High-speed Requirements Pose Technology Challenges
10/03/2024 | Tarja Rapala and Joe Beers, iNEMIThe ever-increasing demands on printed circuit boards to satisfy the needs of tomorrow’s products means that PCB manufacturers must continuously evolve and react to a wide variety of technological and market requirements such as: Functional density: Finer features, higher density, and increased layers; signal integrity: Higher frequencies, driven by higher data transfer speeds and increased data needs; material properties refinement: Must meet performance as well as environmental demands; Smart manufacturing: Automation, robotics, artificial intelligence, augmented and virtual reality, and machine learning are all part of the future PCB manufacturing floor; and time-to-market: Increased urgency to facilitate new design implementation, product introduction and qualification, quicker market differentiation, and survival.
Dana on Data: Resurrecting IPC Class 1
10/01/2024 | Dana Korf -- Column: Dana on DataIPC specifications and guidelines have been the standard performance, quality, acceptance, and design basis for PCB designs for approximately two generations. They have proven to be conservative enough that PCBs far exceed their expected lifetimes in a multitude of environments. Requirements are continually adjusted to reflect improvements in materials and process capability that match the increasing component, interconnect, and cost reduction demands.
Efforts Underway to Deliver More Energy-efficient Fiber Networks
09/25/2024 | BUSINESS WIREFiber service providers have been given a boost in their pursuit of more energy-efficient networks that can unlock significant power savings thanks to a new project launched by Broadband Forum.
AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Penang Expo & Tech Forum
08/30/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Penang Expo & Tech Forum taking place September 25-26 at AC Hotel Penang in Malaysia.