Beyond the Board: How a Diminished Supplier Base Affects Complex PCB Manufacturing Readiness in Defense
Defense Speak Interpreted: Hypersonics Report Back After Six Years of Silence
American Made Advocacy: American Microelectronics Power the Future of High Technology
Global Electronics Association Releases Q4 Standards and Revisions Update
December 24, 2025 | Global Electronics AssociationEstimated reading time: 1 minute
Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q4 2025.
IPC-4556A
Specification for Electroless Nickel/Electroless Palladium Immersion Gold (ENEPIG) Plating for Printed Boards
This performance specification sets the requirements for the use of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a surface finish for printed boards. This performance specification defines ENEPIG deposit thicknesses for applications including soldering, wire bonding, and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS), and original equipment manufacturers (OEM). This standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010 series (IPC-6012, IPC-6013, and IPC-6018) of standards.
IPC-2591 V2.0
Connected Factory Exchange (CFX)
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies—automated, semiautomated, and manual—and is applicable to related mechanical assembly and transactional processes. This Connected Factory Exchange (CFX) standard provides a true ‘‘plug and play’’ Internet of Things (IoT) communication environment throughout manufacturing, where all equipment, manufacturing processes, and transactional stations can communicate with each other without the need for the development and use of bespoke interfaces. CFX-enabled equipment and solutions from different vendors work seamlessly together.
See the full list in the Fall 2025 issue of Community Magazine.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
PHOTO GALLERY: Putting in the Work on Standards, Professional Development
04/16/2026 | I-Connect007Behind every standard, innovation, and step forward in electronics are the people who show up to do the work. This week's photo gallery highlights the attendees who filled meeting rooms and classrooms throughout APEX, collaborating on standards development committees, sharing expertise, and investing in their own growth through professional development. These are the faces of progress, gathered not just to learn, but to contribute and shape what comes next.
East Asia's Electronics Dominance and AI with Sydney Xiao
04/08/2026 | Real Time with... APEX EXPOSydney Xiao, Global Electronics Association – East Asia President emphasizes the region's dominance in electronics manufacturing, particularly with the rise of AI. The association focuses on standards, workforce, technology, and collaboration to help members navigate AI opportunities, highlighting new IC substrate standards and advanced packaging initiatives.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
04/01/2026 | Global Electronics AssociationOn March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
Learning with Leo: Why Risk-based Auditing Is Reshaping Cable Assembly Quality
04/01/2026 | Leo Lambert -- Column: Learning With LeoEffective product development requires early and active participation from all stakeholders. The design process must include input from supply chain, manufacturing engineering, purchasing, quality, and production. A design cannot be considered complete until it has been evaluated against the full manufacturing process, whether executed by an OEM or a subcontractor. Without this collaboration, designs are often released that are not manufacturable in real-world conditions.