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Circuit Technology Center Announces Expanded Tinning Services Capacity
September 16, 2024 | Circuit Technology CenterEstimated reading time: 1 minute
Circuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning. The equipment is also used for automated, touch-less BGA component de-balling, required as part of converting BGA's with lead-free solder to tin-lead solder.
These state-of-the-art machines are high-volume, high-mix systems featuring auto load/unload, multi-component vacuum pickup heads, and dynamic solder waves. All process parameters are controlled, including immersion depths, dwell times, insertion and extraction speed, acceleration, solder pump speed, and temperatures, ensuring that the tinning process complies with stringent industry standards including GEIA-STD-006, J-STD-001, and IEC-TS-62647-4.
"For over 40 years, leading defense and aerospace companies have relied on Circuit Technology Center as the world leader in circuit board level modification, rework, and damage repair services," said Andy Price, Sales Manager. "We are thrilled to announce our increased capacity, offering our defense and high-reliability customers electronic component tinning and alteration services with the same exceptional quality and service that they have come to expect from our company."
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From Factory Floor to ‘The Component Store’
07/25/2025 | Marcy LaRont, I-Connect007Daniel Beauvois began his career in PCB manufacturing 15 years ago with zero industry experience—just a willingness to learn. Daniel immersed himself in every step of circuit board production, from hanging out on the factory floor to giving plant tours. Now, as founder of The Component Store, he’s an independent sales rep known for integrity, persistence, and deep technical knowledge. In this interview, Daniel reflects on his journey, the realities of being an outside rep, and what it takes to earn—and keep—a customer’s trust in an ever-evolving electronics industry.
Flip Electronics Unifies Manufacturing Operations Under New Flip Manufacturing Services Brand
07/22/2025 | PRNewswireFlip Electronics, an authorized distributor of obsolete semiconductors and electronic components, announced that it is rebranding its subsidiary, Resurgent Manufacturing Services, to Flip Electronics Manufacturing Services (FMS).
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
HyRel Technologies, NJ MET Announce Strategic Collaboration for Integrated Component Services
07/16/2025 | HyRelThe collaboration brings together two trusted names in the electronics industry, uniting over 75 years of combined expertise to offer a more complete solution for customers seeking fast, reliable, and cost-effective services.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.