Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets

07/08/2026 | Vern Solberg -- Column: Designer's Notebook
The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects. Passive surface mount components are relatively small, while the packaged semiconductor die is significantly larger than the tiny die element it encases. The plastic-packaged semiconductor, although suitable for use on PCBs, is far too bulky for those developing electronics that require miniaturization: new product introduction systems for physically stressful operating conditions, such as aeronautics, military ordinance, and space missions.

Designers Notebook: Heterogeneous Interposer Design Challenge, Part 3

03/16/2026 | Vern Solberg -- Column: Designer's Notebook
In just about any industry, time-to-market will establish the difference between the leaders and followers. Any new electronic product introduced into the market must meet or exceed stated performance criteria and provide reliable service to the end user experience. The original single-core monolithic system-on-chip developed for the earlier, less complex applications has long been superseded by the more sophisticated multiple-core variations.

Fibocom Launches Highly Integrated 5G SoC Dongle for Global Connectivity

03/05/2026 | PRNewswire
At MWC 2026, Fibocom unveiled its new 5G SoC Dongle solution series, designed with an all-in-one SoC architecture that integrates high-performance 5G communication, an intelligent operating system, and flexible eSIM/vSIM services.

From Technology to Talent: The Ultimate Formula for Success

01/09/2026 | Marcy LaRont, PCB007 Magazine
American Standard Circuits (ASC) has been a cornerstone of the U.S. PCB manufacturing industry. With more than 50 years of expertise, the company has evolved from its early focus on RF technology into a full-spectrum provider of advanced PCB solutions, including RF/microwave, metal-backed, backplane, flex and rigid-flex, and ultra high density interconnect (UHDI) boards. Customers range from military and aerospace applications to high-reliability commercial sectors, including medical, telecom, radar, and transportation.

Orbit Wins Israeli Ministry of Defense Tender for $9.1M Satellite Communication Systems

12/04/2024 | PRNewswire
Orbit Communication Systems Ltd., a leading global provider of maritime and airborne SATCOM terminals, tracking ground station solutions, and mission-critical airborne audio management systems has announced that it has won a tender from the Israeli Ministry of Defense to supply Multi-Purpose satellite communication Terminals (MPTs) for mobile and stationary ground platforms, valued at approximately $9.1 million.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in