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STMicroelectronics Announces Expanded "Lab-in-Fab" Collaboration in Singapore to Advance Piezoelectric MEMS Technology

05/22/2025 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, in collaboration with the A*STAR Institute of Microelectronics (A*STAR IME) and ULVAC, announces the expansion of the “Lab-in-Fab” (LiF) in Singapore.

GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation

05/22/2025 | GlobalFoundries
GlobalFoundries (GF)  announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore’s lead public sector research and development (R&D) agency.

OKI Launches 124-Layer Circuit Board Technology

05/22/2025 | Andy Shaughnessy, Design007 Magazine
During PCB East, OKI Circuit Technology unveiled its latest innovation: a 124-layer printed circuit board. In this interview, “Dennie” Kazuo Kawahara, president of OKI Data Americas, and Eiichi Aki, sales and marketing specialist at OKI Circuit Technology, shared their insights into this feat. With plans for mass production starting in October, this board is designed for high-bandwidth memory applications, accommodating the demanding requirements of AI chips.

Siemens Democratizes AI-driven PCB Design for Small and Medium Electronics Teams

05/21/2025 | Siemens
Siemens Digital Industries Software announced today that it is making its AI-enhanced electronic systems design technology more accessible to small and mid-sized businesses (SMB) with PADS™ Pro Essentials software and Xpedition™ Standard software.

Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

05/20/2025 | Deca Technologies
Deca Technologies announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec.
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