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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/20/2024 | Andy Shaughnessy, I-Connect007
It’s been a busy week in the world of PCB design and manufacturing. In this week’s roundup, there’s a little bit of everything. We have a look at PCB technology of tomorrow, an interview with an engineer who designs both PCBs and ICs, and government relations news from Washington, D.C. We also have an article on dispensing technology, and a final installment of our podcast on “designing for reality.”

Routing, Final Fab, and QC: Don’t Miss the Final Episode of On the Line With… Designing for Reality

09/19/2024 | I-Connect007
Don't miss the final episode of "On the Line With… Designing for Reality," in which ASC Sunstone General Manager Matt Stevenson wraps up his deep dive into the PCB manufacturing process with a discussion of Routing, Final Fabrication, and Quality Control.

EDA Market to Grow $8.7 Billion (2024-2028) with AI's Rising Impact on Trends

09/19/2024 | PRNewswire
The market is estimated to grow at a CAGR of 10.26%  during the forecast period. Growing significance of eda in electronic design process is driving market growth, with a trend towards machine learning disrupting global eda market

PCB Designers: ‘Level Up’ IC, Packaging Knowledge

09/16/2024 | Andy Shaughnessy, Design007 Magazine
Soo Lan Cheah is kind of a unicorn in the industry. She is an IPC instructor based in Malaysia, and she has years of experience designing integrated circuits and printed circuit boards. I knew I had to get her thoughts for this issue on silicon-to-systems. I asked Soo Lan to discuss her cross-discipline background and what silicon-to-systems means to her.

IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

09/16/2024 | IPC
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
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