Intel, AWS Expand Strategic Collaboration, Helping Advance U.S.-based Chip Manufacturing
September 20, 2024 | IntelEstimated reading time: 2 minutes
Intel Corp. (INTC) and Amazon Web Services. Inc. (AWS), an Amazon.com company, announced a co-investment in custom chip designs under a multi-year, multi-billion-dollar framework covering product and wafers from Intel. This is a significant expansion of the two companies’ longstanding strategic collaboration to help customers power virtually any workload and accelerate the performance of artificial intelligence (AI) applications.
As part of the expanded collaboration, Intel will produce an AI fabric chip for AWS on Intel 18A, the company’s most advanced process node. Intel will also produce a custom Xeon 6 chip on Intel 3, building on the existing partnership under which Intel produces Xeon Scalable processors for AWS.
“This expansion of our longtime relationship with AWS reflects the strength of our process technology and delivers differentiated solutions for customer workloads,” said Pat Gelsinger, Intel CEO. “Intel’s chip design and manufacturing capabilities, combined with the comprehensive and broadly adopted cloud, AI and machine learning services of AWS, will unleash innovation across our shared ecosystem and support the growth of both businesses, as well as a sustainable domestic AI supply chain.”
“At AWS, we're committed to delivering the most powerful and innovative cloud infrastructure to our customers,” said Matt Garman, CEO at AWS. “By co-developing next-generation AI fabric chips on Intel 18A, we continue our long-standing collaboration, dating back to 2006 when we launched the first Amazon EC2 instance featuring their chips. Our continued collaboration allows us to empower our joint customers with the ability to run any workload and unlock new AI capabilities.”
With this expanded collaboration, Intel and AWS underscore their commitments to accelerating U.S.-based semiconductor manufacturing and creating a vibrant AI ecosystem in Ohio. Intel continues to be committed to the New Albany area and its plans to build leading edge semiconductor manufacturing. AWS is planning to invest $7.8 billion to expand its data center operations in Central Ohio, in addition to the $10.3 billion it has invested in the state of Ohio since 2015.
“This collaboration between Intel and AWS is a great development for U.S.-based manufacturing and solidifying Ohio as a leader in AI,” said Ohio Governor Mike DeWine. “Today’s announcement furthers Intel’s commitment to U.S. manufacturing sites, like Ohio’s, as well as AWS’s commitment to its nearly decade-long investment in our state.”
AWS and Intel have a more than 18-year relationship dedicated to helping organizations of all sizes to develop, build, and deploy their mission critical workloads in the cloud, while also supporting them to reduce cost and complexity, increase security, accelerate business outcomes, and scale to meet their current and future computing requirements. Going forward, Intel and AWS also intend to explore the potential for further designs to be produced by Intel based on Intel 18A and future process nodes including Intel 18AP and Intel 14A, which is expected to be produced in Intel’s Ohio facilities, as well as the migration of existing Intel designs to these platforms.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Intel, Cisco Collaboration Delivers Industry’s First Systems Approach for AI Workloads at the Edge
11/06/2025 | IntelCisco Unified Edge with Intel Xeon 6 SoCs delivers a future-ready AI infrastructure, boosting performance and security while reducing network traffic through real-time inferencing at the data source.
Global Electronics Association Unveils Powerhouse Tech and Innovation Keynote Speakers for APEX EXPO 2026
10/29/2025 | Global Electronics AssociationThe Global Electronics Association announces its APEX EXPO keynote lineup, featuring industry titans exploring the frontiers of quantum computing, artificial intelligence, and the electrification of global industries.
TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand
10/27/2025 | I-Connect007 Editorial TeamTSMC said earlier this month that it’s speeding up the rollout of its most advanced chip technology in the US because of rising AI product demand and Intel’s growing competition, The Register reported.
SAIC to Acquire SilverEdge Government Solutions
10/09/2025 | SAICScience Applications International Corp., a leading mission integrator supporting defense, space, intelligence and civilian agencies, announced it has entered into a definitive agreement to acquire SilverEdge Government Solutions from private equity firm Godspeed Capital for $205 million in cash.
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.