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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Kingboard Raises $1.5 Billion Through Kingboard Laminates Stake Sale to Support PCB Expansion

06/17/2026 | I-Connect007 Editorial Team
Kingboard Holdings has raised approximately HK$11.77 billion (US$1.5 billion) through the sale of a portion of its stake in subsidiary Kingboard Laminates Holdings, as growing demand from AI infrastructure drives investment across the PCB and electronics materials supply chain.

SCHMID Group Records More than €26 Million Order Intake since Mid-May

06/16/2026 | Globe Newswire
SCHMID Group announces a strong combined order intake of more than €26 million since mid-May 2026, reflecting multiple customer orders and continued market momentum in advanced PCB and substrate manufacturing technologies for AI infrastructure and next-generation optical module supply chains.

Adani Enterprises, Jabil Target Strategic Alliance for AI Data Center Infrastructure in India

06/16/2026 | Jabil Inc.
Adani Group, India’s leading integrated infrastructure and green energy conglomerate, and Jabil Inc., a global leader in engineering, supply chain, and manufacturing solutions, announced the intent to form a strategic alliance to establish a world-class, vertically integrated AI and data center infrastructure manufacturing platform in India.

Schneider Electric, Foxconn Ink Strategic Collaboration to Accelerate Next-gen AI Data Centers

06/15/2026 | Globe Newswire
Schneider Electric, a global energy technology leader, announced a strategic collaboration with Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, to help define and scale the next generation of AI data centers.

NEURA Robotics Announces Record Series C of up to $1.4 Billion

06/12/2026 | BUSINESS WIRE
NEURA Robotics, the pioneer in cognitive robotics and creator of the Neuraverse, announced a landmark Series C financing with a total round size of up to $1.4 billion to accelerate its mission of building the world’s leading Physical AI platform.
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