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September 20, 2024 | IndiumEstimated reading time: 2 minutes
Indium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts.
The first presentation, titled Novel Innovative Thermal Interface Materials for Bare Die Processors and Applications Methods, will be co-presented by Indium Corporation Global Account Manager, Tim Jensen, and Senior Product Specialist for Thermal Interface Materials, Miloš Lazić. This session will focus on the latest developments in metallic thermal interface materials (TIMs) intended primarily for use as a TIM1.5 and associated assembly processes.
The second presentation, titled Liquid Metal Jetting for High-Performance Computing Applications, will be delivered by Lazić and co-author Sunny Agarwal, ITW EAE. It outlines the challenges faced during liquid metal dispensing in high-volume manufacturing, and how to control several variables that affect dispensing for higher throughput and process reliability.
The third presentation, Study of Thermal Conductivity and Reliability of InAg Soldering Thermal Interface Material by Reflow Process in Formic Acid Atmosphere for TIM1 IC Module Package, will be delivered by Indium Corporation Senior Chemist in Thermal Interface Materials/R&D, Guangyu Fan, and R&D Assistant Manager for Thermal Interface Materials and Senior Metallurgist, Dr. Jie Geng. This session will explore the impact of different compositions of InAg alloys and bondline thickness (BLT) on voiding performance, delamination, and thermal conductivity of the soldered joints, to include the reliability results.
Additionally, Jensen co-authored a poster presentation, Developments in Thermal Interface Materials for Liquid Immersion Systems, that explores which common organic and polymeric materials within server systems are identified as principal fluid contaminants and, specifically, what TIM types are suitable and compatible for use without contaminating the immersion fluid. Examples of processors and immersion systems, illustrations of TIM2 applications for processors within immersion systems for boiling enhancement components, and supporting references will be provided.
About the Speakers
Tim Jensen leads a matrixed team at Indium Corporation, focusing on customer engagement and the commercialization of new Thermal Interface Material technologies, particularly for 5G and AI. He holds a bachelor’s degree in chemical engineering from Clarkson University and an MBA from Syracuse University. Jensen also serves on the SMTA Board of Directors, where he leads efforts to expand the association's international presence.
Miloš Lazić specializes in developing new thermal materials and testing methods for evaluating power and thermal products. He earned his master’s degree in electronics engineering and his bachelor’s in electrical engineering from the University of Nis in Serbia. Lazić is also certified as an energy efficiency engineer and SMT process engineer, and is fluent in English, Serbian, Croatian, and Bosnian.
Dr. Guangyu Fan has been with Indium Corporation since 2011, bringing a strong academic background with a doctorate in polymer chemistry and physics, a master’s degree in polymer chemistry, and a bachelor’s degree in chemistry. He is a graduate of the Dale Carnegie Leadership Skills for Success program.
Dr. Jie Geng joined Indium Corporation in 2016 as a research metallurgist and has since advanced to R&D Group Leader. He has a doctorate in metallurgy, a master’s degree in materials science, and a bachelor’s degree in materials science and engineering, with notable contributions to the development of Indalloy®292 and Durafuse® HR.
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