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Sparrow Quantum Secures €21.5 Million to Accelerate Photonic Quantum Innovation in Europe

04/10/2025 | BUSINESS WIRE
Sparrow Quantum, a leading European supplier of photonic quantum chips, has secured €21.5 million in Series A funding to accelerate the development and commercialization of its world-leading quantum chip technology.

Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs

04/03/2025 | PRNewswire
Ansys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution that provides superior capacity and performance, easily accommodating large designs in the cloud.

SEMI, ESIA Rally Political Support for a European Semiconductor Strategy

03/20/2025 | SEMI
Seeking to explore semiconductor policy measures that can strengthen the industrial policy in the European Union, SEMI and the European Semiconductor Industry Association (ESIA) have successfully held a high-level roundtable event in the European Parliament under the auspices of Members of the European Parliament (MEPs) Bart Groothuis (Renew Europe), Oliver Schenk (European People’s Party) and Dan Nica (Socialists and Democrats Party).

Defense Speak Interpreted: It’s Time for a ‘Defense-Speak’ Update

03/18/2025 | Dennis Fritz -- Column: Defense Speak Interpreted
I’m Denny Fritz, the author of 30 “Defense Speak Interpreted” columns from 2018 to 2022. My original concept for this monthly op-ed was to explain the unique acronym language used by the U.S. Defense Department: CMMC, DIUx, C4ISR, JEDI, etc. When I started consulting for NSWV Crane almost 20 years ago, I would find myself sitting in meetings, perplexed at what I heard. Half the conversations were using acronyms that were foreign to me.

YINCAE: UF 158UL Redefines Underfill for Large Chips

03/12/2025 | YINCAE
YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.
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