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Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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HANZA CEO Erik Stenfors Increases Stake in Company
September 26, 2024 | HANZAEstimated reading time: Less than a minute
Erik Stenfors, CEO of HANZA, a leading global provider of advanced manufacturing services, has purchased 8,000 shares in the company.
The shares were acquired on September 25, 2024, at a price of SEK 52.16 per share, bringing Stenfors' total holdings in HANZA to 630,000 shares.
This purchase demonstrates Stenfors' continued confidence in HANZA's future growth and success. The company has been making significant strides in modernizing and streamlining the manufacturing industry through its supply-chain advisory services and regional manufacturing clusters.
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Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production
12/23/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
SIA Praises Finalization of CHIPS Incentives to Supplement SK Hynix’s $3.87 Billion Investment in Indiana
12/20/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and SK hynix. The incentives will supplement the company’s $3.87 billion investment in Indiana for advanced packaging operations and R&D.
RTX's Raytheon and Ursa Major Conduct Successful Flight Test
12/20/2024 | RTXRaytheon, an RTX business, and Ursa Major announced its advanced long-range solid rocket motor completed a successful missile flight test for the U.S. Army. The companies' combined experience and expertise in digital engineering was a critical factor in accelerating the design and development of this transformational capability.
ViTrox Welcomes Gemaddis as a New Sales Channel Partner in France
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The Effects of Copper on a Transmission Line
12/23/2024 | Todd Kolmodin, Gardien ServicesAs technology advances, our substrates become increasingly smaller, and chip technology has progressed to where HDI and UHDI are household terms. Ten years ago, this new design architecture would strike fear in the hearts of any plating engineer. Unfortunately, North American and European manufacturing has lagged due to excessive offshoring of commercial and some high-reliability product lines. Fortunately, most of the military and aerospace product has remained controlled. But in doing so, the designs utilized by the mil/aero and medical sectors’ reliability lines were corralled into the manufacturing capabilities of the North American and European providers.