Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Aismalibar to Showcase Thermal Management Solutions for EV Battery Systems at The Battery Show North America 2024

09/27/2024 | Aismalibar
Aismalibar, a leader in innovative thermal management materials, will be presenting its newest solutions for electric vehicle (EV) battery systems at The Battery Show North America from October 7-11, 2024. Located at Huntington Place, Detroit, MI, Aismalibar will exhibit at booth 6231, unveiling a range of cutting-edge Thermal Interface Materials (TIMs) designed to improve the safety, performance, and longevity of EV batteries.

TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

09/27/2024 | ANSYS
Ansys and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next generation multiphysics solutions for a wider array of advanced semiconductor technologies.

Connect the Dots: Designing for Reality: Outer Layer Imaging

09/26/2024 | Matt Stevenson -- Column: Connect the Dots
Welcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.

Siemens Extends Collaboration with TSMC to Advance Integrated Circuit and Systems Design

09/25/2024 | Siemens
Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications and innovative technology enablement for the foundry’s newest process technologies.

Würth Elektronik at electronica 2024

09/25/2024 | Wurth Electronics
Würth Elektronik is exhibiting at electronica – the leading international trade show – in Munich, November 12-15, 2024.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in