Flexible Thinking Flexible Circuit Technology—Looking Back and Forward
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Amphenol Trackwise to Exhibit at electronica 2024
September 27, 2024 | Amphenol TrackwiseEstimated reading time: Less than a minute
Amphenol Trackwise Designs ltd will be exhibiting their weight and space saving, patented manufacturing process, Improved Harness Technology™ (IHT) at Electronica 2024, Munich from 12-15 November.
At the show, Amphenol Trackwise, who can be found in Hall A2, Booth 309, will showcase how Improved Harness Technology™ (IHT), can deliver space and weight savings – as well as increased repeatability and reliability – helping manufacturers in their journey towards sustainability and decarbonisation.
“With the All Electric Society very much on the horizon, we’re delighted to take our place alongside some of the most innovative solutions in the world of electronics.” said Philip Johnston, Amphenol Trackwise Business Unit Director. “We look forward to meeting with current and future customers and suppliers over the three days, and we invite anyone who would like to explore weight and space saving interconnect solutions to visit us in Hall 2, Booth 309.”
Share on:
Suggested Items
Collins Aerospace Approved to Begin Full Rate Production of MAPS Gen II system
03/13/2025 | Collins AerospaceCollins Aerospace, an RTX business, has received approval for Full Rate Production of the Mounted Assured Positioning, Navigation and Timing (PNT) Generation II system (MAPS GEN II).
Eltek Reports Full Year and Q4 2024 Financial Results
03/13/2025 | EltekEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the full year and fourth quarter ended December 31, 2024.
YINCAE: UF 158UL Redefines Underfill for Large Chips
03/12/2025 | YINCAEYINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.
MicroCraft to Unveil Three New Models at IPC APEX EXPO 2025
03/12/2025 | MicroCraftMicroCraft, a global leader in PCB testing and precision inkjet printing solutions, is set to showcase three cutting-edge models at IPC APEX EXPO 2025 at the Anaheim Convention Center March 18-20 in booth #4105. Each model represents the latest advancements in speed, accuracy, and automation across MicroCraft’s three product lines.
Pudu Robotics' PUDU T300 Achieves CE-MD and CE-RED Certifications
03/12/2025 | PRNewswirePudu Robotics, a global leader in service robotics sector, announced its innovative industrial delivery robot, the PUDU T300, has obtained both the CE-MD (Machinery Directive) and CE-RED (Radio Equipment Directive) certificates by TÜV SÜD, a world-renowned testing and certification organization.